ELECTRICAL DEVICE MANUFACTURING TECHNIQUES
The present invention relates to a method of making an RFID transponder comprising: placing a chip having a bottom surface and a top surface on a thermoplastic substrate with the bottom surface of the chip contacting a top surface of the thermoplastic substrate; heating at least one of the thermopla...
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| creator | FERGUSON, SCOTT W MEHRABI, REZA MEHRABI, ALI |
| description | The present invention relates to a method of making an RFID transponder comprising:
placing a chip having a bottom surface and a top surface on a thermoplastic substrate with the bottom surface of the chip contacting a top surface of the thermoplastic substrate;
heating at least one of the thermoplastic substrate or chip with thermal radiation thereby elevating the temperature of the thermoplastic substrate and consequently softening the thermoplastic substrate;
embedding the chip into the thermoplastic substrate by applying pressure to the chip while the substrate is heated to the elevated temperature; and
coupling the chip to an antenna structure, wherein the coupling includes:
depositing the antenna structure with conductive ink onto the thermoplastic substrate; and
connecting the antenna structure to the interposer leads of the RFID interposer. |
| format | Patent |
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placing a chip having a bottom surface and a top surface on a thermoplastic substrate with the bottom surface of the chip contacting a top surface of the thermoplastic substrate;
heating at least one of the thermoplastic substrate or chip with thermal radiation thereby elevating the temperature of the thermoplastic substrate and consequently softening the thermoplastic substrate;
embedding the chip into the thermoplastic substrate by applying pressure to the chip while the substrate is heated to the elevated temperature; and
coupling the chip to an antenna structure, wherein the coupling includes:
depositing the antenna structure with conductive ink onto the thermoplastic substrate; and
connecting the antenna structure to the interposer leads of the RFID interposer.</description><language>eng ; fre ; ger</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; BASIC ELECTRIC ELEMENTS ; BOOK COVERS ; BOOKBINDING ; CALCULATING ; COMPUTING ; COUNTING ; DETECTING MASSES OR OBJECTS ; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FILES ; GEOPHYSICS ; GRAVITATIONAL MEASUREMENTS ; HANDLING RECORD CARRIERS ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; LOOSE LEAVES ; MEASURING ; MOVABLE-STRIP WRITING OR READING APPARATUS ; PERFORMING OPERATIONS ; PHYSICS ; PRESENTATION OF DATA ; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES ; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR ; RECOGNITION OF DATA ; RECORD CARRIERS ; SEMICONDUCTOR DEVICES ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; SPECIAL PRINTED MATTER ; TESTING ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2008</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080903&DB=EPODOC&CC=EP&NR=1964034A2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25555,76308</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080903&DB=EPODOC&CC=EP&NR=1964034A2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FERGUSON, SCOTT W</creatorcontrib><creatorcontrib>MEHRABI, REZA</creatorcontrib><creatorcontrib>MEHRABI, ALI</creatorcontrib><title>ELECTRICAL DEVICE MANUFACTURING TECHNIQUES</title><description>The present invention relates to a method of making an RFID transponder comprising:
placing a chip having a bottom surface and a top surface on a thermoplastic substrate with the bottom surface of the chip contacting a top surface of the thermoplastic substrate;
heating at least one of the thermoplastic substrate or chip with thermal radiation thereby elevating the temperature of the thermoplastic substrate and consequently softening the thermoplastic substrate;
embedding the chip into the thermoplastic substrate by applying pressure to the chip while the substrate is heated to the elevated temperature; and
coupling the chip to an antenna structure, wherein the coupling includes:
depositing the antenna structure with conductive ink onto the thermoplastic substrate; and
connecting the antenna structure to the interposer leads of the RFID interposer.</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BOOK COVERS</subject><subject>BOOKBINDING</subject><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>DETECTING MASSES OR OBJECTS</subject><subject>DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FILES</subject><subject>GEOPHYSICS</subject><subject>GRAVITATIONAL MEASUREMENTS</subject><subject>HANDLING RECORD CARRIERS</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>LOOSE LEAVES</subject><subject>MEASURING</subject><subject>MOVABLE-STRIP WRITING OR READING APPARATUS</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>PRESENTATION OF DATA</subject><subject>PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES</subject><subject>PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR</subject><subject>RECOGNITION OF DATA</subject><subject>RECORD CARRIERS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>SPECIAL PRINTED MATTER</subject><subject>TESTING</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2008</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNBy9XF1DgnydHb0UXBxDfN0dlXwdfQLdXN0DgkN8vRzVwhxdfbw8wwMdQ3mYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgGGlmYmBsYmjkbGRCgBABc3JGY</recordid><startdate>20080903</startdate><enddate>20080903</enddate><creator>FERGUSON, SCOTT W</creator><creator>MEHRABI, REZA</creator><creator>MEHRABI, ALI</creator><scope>EVB</scope></search><sort><creationdate>20080903</creationdate><title>ELECTRICAL DEVICE MANUFACTURING TECHNIQUES</title><author>FERGUSON, SCOTT W ; MEHRABI, REZA ; MEHRABI, ALI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP1964034A23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2008</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BOOK COVERS</topic><topic>BOOKBINDING</topic><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>DETECTING MASSES OR OBJECTS</topic><topic>DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FILES</topic><topic>GEOPHYSICS</topic><topic>GRAVITATIONAL MEASUREMENTS</topic><topic>HANDLING RECORD CARRIERS</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>LOOSE LEAVES</topic><topic>MEASURING</topic><topic>MOVABLE-STRIP WRITING OR READING APPARATUS</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>PRESENTATION OF DATA</topic><topic>PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES</topic><topic>PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR</topic><topic>RECOGNITION OF DATA</topic><topic>RECORD CARRIERS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>SPECIAL PRINTED MATTER</topic><topic>TESTING</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>FERGUSON, SCOTT W</creatorcontrib><creatorcontrib>MEHRABI, REZA</creatorcontrib><creatorcontrib>MEHRABI, ALI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FERGUSON, SCOTT W</au><au>MEHRABI, REZA</au><au>MEHRABI, ALI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRICAL DEVICE MANUFACTURING TECHNIQUES</title><date>2008-09-03</date><risdate>2008</risdate><abstract>The present invention relates to a method of making an RFID transponder comprising:
placing a chip having a bottom surface and a top surface on a thermoplastic substrate with the bottom surface of the chip contacting a top surface of the thermoplastic substrate;
heating at least one of the thermoplastic substrate or chip with thermal radiation thereby elevating the temperature of the thermoplastic substrate and consequently softening the thermoplastic substrate;
embedding the chip into the thermoplastic substrate by applying pressure to the chip while the substrate is heated to the elevated temperature; and
coupling the chip to an antenna structure, wherein the coupling includes:
depositing the antenna structure with conductive ink onto the thermoplastic substrate; and
connecting the antenna structure to the interposer leads of the RFID interposer.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS BOOK COVERS BOOKBINDING CALCULATING COMPUTING COUNTING DETECTING MASSES OR OBJECTS DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILES GEOPHYSICS GRAVITATIONAL MEASUREMENTS HANDLING RECORD CARRIERS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM LOOSE LEAVES MEASURING MOVABLE-STRIP WRITING OR READING APPARATUS PERFORMING OPERATIONS PHYSICS PRESENTATION OF DATA PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR RECOGNITION OF DATA RECORD CARRIERS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS SPECIAL PRINTED MATTER TESTING TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | ELECTRICAL DEVICE MANUFACTURING TECHNIQUES |
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