Base plate for a heat sink and electronic device with a base plate

A base plate (1) for a heat sink comprises a cooling plate (2) and spacer elements (31), which are arranged on the surface of the cooling plate (2). The spacer elements (3) and the cooling plate (2) are made as one piece and the material in the surface region of the cooling plate (2) and of the spac...

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Bibliographische Detailangaben
Hauptverfasser:	SCHNEIDER, DANIEL, CHEN, MAKAN, ZEHRINGER, RAYMOND
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A base plate (1) for a heat sink comprises a cooling plate (2) and spacer elements (31), which are arranged on the surface of the cooling plate (2). The spacer elements (3) and the cooling plate (2) are made as one piece and the material in the surface region of the cooling plate (2) and of the spacer elements being the same and formed in the same process. The presence of the spacer elements allows soldering of the base plate to an insulating substrate (8) carrying a power electronic component (4) with less danger for tilting of the substrate and thereby improving the heat dissipation of the solder connection (5).