SILICONE COMPOSITION FOR ENCAPSULATING LUMINESCENT ELEMENT AND LUMINESCENT DEVICE
A silicone composition for sealing a light emitting element includes: (A) a vinyl group-containing organopolysiloxane having a three-dimensional network structure represented by an average unit formula: (SiO 4/2 ) a (ViR 2 SiO 1/2 ) b (R 3 SiO 1/2 ) c (where Vi represents a vinyl group, R's are...
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| creator | HIRAI, NOBUO MOCHIZUKI, KIKUO |
| description | A silicone composition for sealing a light emitting element includes: (A) a vinyl group-containing organopolysiloxane having a three-dimensional network structure represented by an average unit formula:
(SiO 4/2 ) a (ViR 2 SiO 1/2 ) b (R 3 SiO 1/2 ) c (where Vi represents a vinyl group, R's are identical or different substituted or unsubstituted monovalent hydrocarbon groups other than alkenyl groups, and a, b, and c are positive numbers satisfying that a/ (a + b + c) is 0.2 to 0.6 and b/(a+b+c) is 0.001 to 0.2); (B) an organohydrogenpolysiloxane which has at least two hydrogen atoms, each hydrogen atom being bonded to a silicon atom per molecule, the organohydrogenpolysiloxane being contained in such an amount that an amount of a hydrogen atom bonded to a silicon atom is 0.3 to 3.0 mol per 1mol of a vinyl group bonded to a silicon atom in the component (A) ; and (C) a hydrosilylation catalyst (catalytic amount), wherein a coefficient of linear expansion of the composition after curing is 10 x 10 -6 to 290 x 10 -6 /°C. It is possible to obtain a cured product whose residual stress with a support substrate is reduced and which has long-term satisfactory and stable adhesiveness. |
| format | Patent |
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(SiO 4/2 ) a (ViR 2 SiO 1/2 ) b (R 3 SiO 1/2 ) c (where Vi represents a vinyl group, R's are identical or different substituted or unsubstituted monovalent hydrocarbon groups other than alkenyl groups, and a, b, and c are positive numbers satisfying that a/ (a + b + c) is 0.2 to 0.6 and b/(a+b+c) is 0.001 to 0.2); (B) an organohydrogenpolysiloxane which has at least two hydrogen atoms, each hydrogen atom being bonded to a silicon atom per molecule, the organohydrogenpolysiloxane being contained in such an amount that an amount of a hydrogen atom bonded to a silicon atom is 0.3 to 3.0 mol per 1mol of a vinyl group bonded to a silicon atom in the component (A) ; and (C) a hydrosilylation catalyst (catalytic amount), wherein a coefficient of linear expansion of the composition after curing is 10 x 10 -6 to 290 x 10 -6 /°C. It is possible to obtain a cured product whose residual stress with a support substrate is reduced and which has long-term satisfactory and stable adhesiveness.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20151014&DB=EPODOC&CC=EP&NR=1845133B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20151014&DB=EPODOC&CC=EP&NR=1845133B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HIRAI, NOBUO</creatorcontrib><creatorcontrib>MOCHIZUKI, KIKUO</creatorcontrib><title>SILICONE COMPOSITION FOR ENCAPSULATING LUMINESCENT ELEMENT AND LUMINESCENT DEVICE</title><description>A silicone composition for sealing a light emitting element includes: (A) a vinyl group-containing organopolysiloxane having a three-dimensional network structure represented by an average unit formula:
(SiO 4/2 ) a (ViR 2 SiO 1/2 ) b (R 3 SiO 1/2 ) c (where Vi represents a vinyl group, R's are identical or different substituted or unsubstituted monovalent hydrocarbon groups other than alkenyl groups, and a, b, and c are positive numbers satisfying that a/ (a + b + c) is 0.2 to 0.6 and b/(a+b+c) is 0.001 to 0.2); (B) an organohydrogenpolysiloxane which has at least two hydrogen atoms, each hydrogen atom being bonded to a silicon atom per molecule, the organohydrogenpolysiloxane being contained in such an amount that an amount of a hydrogen atom bonded to a silicon atom is 0.3 to 3.0 mol per 1mol of a vinyl group bonded to a silicon atom in the component (A) ; and (C) a hydrosilylation catalyst (catalytic amount), wherein a coefficient of linear expansion of the composition after curing is 10 x 10 -6 to 290 x 10 -6 /°C. It is possible to obtain a cured product whose residual stress with a support substrate is reduced and which has long-term satisfactory and stable adhesiveness.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAgM9vTxdPb3c1Vw9vcN8A_2DPH091Nw8w9ScPVzdgwIDvVxDPH0c1fwCfX19HMNdnb1C1Fw9XH1BdGOfi4o4i6uYZ7OrjwMrGmJOcWpvFCam0HBzTXE2UM3tSA_PrW4IDE5NS-1JN41wNDCxNTQ2NjJ0JgIJQB_Ry9O</recordid><startdate>20151014</startdate><enddate>20151014</enddate><creator>HIRAI, NOBUO</creator><creator>MOCHIZUKI, KIKUO</creator><scope>EVB</scope></search><sort><creationdate>20151014</creationdate><title>SILICONE COMPOSITION FOR ENCAPSULATING LUMINESCENT ELEMENT AND LUMINESCENT DEVICE</title><author>HIRAI, NOBUO ; MOCHIZUKI, KIKUO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP1845133B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2015</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>HIRAI, NOBUO</creatorcontrib><creatorcontrib>MOCHIZUKI, KIKUO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HIRAI, NOBUO</au><au>MOCHIZUKI, KIKUO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SILICONE COMPOSITION FOR ENCAPSULATING LUMINESCENT ELEMENT AND LUMINESCENT DEVICE</title><date>2015-10-14</date><risdate>2015</risdate><abstract>A silicone composition for sealing a light emitting element includes: (A) a vinyl group-containing organopolysiloxane having a three-dimensional network structure represented by an average unit formula:
(SiO 4/2 ) a (ViR 2 SiO 1/2 ) b (R 3 SiO 1/2 ) c (where Vi represents a vinyl group, R's are identical or different substituted or unsubstituted monovalent hydrocarbon groups other than alkenyl groups, and a, b, and c are positive numbers satisfying that a/ (a + b + c) is 0.2 to 0.6 and b/(a+b+c) is 0.001 to 0.2); (B) an organohydrogenpolysiloxane which has at least two hydrogen atoms, each hydrogen atom being bonded to a silicon atom per molecule, the organohydrogenpolysiloxane being contained in such an amount that an amount of a hydrogen atom bonded to a silicon atom is 0.3 to 3.0 mol per 1mol of a vinyl group bonded to a silicon atom in the component (A) ; and (C) a hydrosilylation catalyst (catalytic amount), wherein a coefficient of linear expansion of the composition after curing is 10 x 10 -6 to 290 x 10 -6 /°C. It is possible to obtain a cured product whose residual stress with a support substrate is reduced and which has long-term satisfactory and stable adhesiveness.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | SILICONE COMPOSITION FOR ENCAPSULATING LUMINESCENT ELEMENT AND LUMINESCENT DEVICE |
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