ELEMENT MOUNTING SUBSTRATE AND METHOD FOR MANUFACTURING SAME
The element-mounting substrate of the present invention comprises a ceramic substrate, an electrode layer formed on the substrate and a ceramic coating layer which is formed on a part of the electrode layer and has a thickness of 5 to 50 µm. The process for producing an element-mounting substrate of...
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| creator | GOTOH, KUNIHIRO MAEDA, MASAKATSU YAMAMOTO, YASUYUKI |
| description | The element-mounting substrate of the present invention comprises a ceramic substrate, an electrode layer formed on the substrate and a ceramic coating layer which is formed on a part of the electrode layer and has a thickness of 5 to 50 µm. The process for producing an element-mounting substrate of the present invention comprises a step of forming an electrode precursor layer in the shape of a pattern of an electrode layer on a ceramic plate or a green sheet of a large diameter, a step of forming a ceramic coating precursor layer on a part of the electrode precursor layer and a step of firing the resulting precursor, and in this process, it is preferable to form the ceramic coating layer so as to cover the electrode layer on a predetermined cutting line of the firing product. According to the element-mounting substrate of the invention in which a part of the electrode layer is covered with a ceramic, a failure in mounting an element attributable to the thickness of the ceramic coating layer can be prevented when the element is mounted, and besides, peeling or cracking of the electrode layer due to an impact given in the dicing can be prevented. |
| format | Patent |
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The process for producing an element-mounting substrate of the present invention comprises a step of forming an electrode precursor layer in the shape of a pattern of an electrode layer on a ceramic plate or a green sheet of a large diameter, a step of forming a ceramic coating precursor layer on a part of the electrode precursor layer and a step of firing the resulting precursor, and in this process, it is preferable to form the ceramic coating layer so as to cover the electrode layer on a predetermined cutting line of the firing product. According to the element-mounting substrate of the invention in which a part of the electrode layer is covered with a ceramic, a failure in mounting an element attributable to the thickness of the ceramic coating layer can be prevented when the element is mounted, and besides, peeling or cracking of the electrode layer due to an impact given in the dicing can be prevented.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; DEVICES USING STIMULATED EMISSION ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20101013&DB=EPODOC&CC=EP&NR=1830414A4$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20101013&DB=EPODOC&CC=EP&NR=1830414A4$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GOTOH, KUNIHIRO</creatorcontrib><creatorcontrib>MAEDA, MASAKATSU</creatorcontrib><creatorcontrib>YAMAMOTO, YASUYUKI</creatorcontrib><title>ELEMENT MOUNTING SUBSTRATE AND METHOD FOR MANUFACTURING SAME</title><description>The element-mounting substrate of the present invention comprises a ceramic substrate, an electrode layer formed on the substrate and a ceramic coating layer which is formed on a part of the electrode layer and has a thickness of 5 to 50 µm. 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The process for producing an element-mounting substrate of the present invention comprises a step of forming an electrode precursor layer in the shape of a pattern of an electrode layer on a ceramic plate or a green sheet of a large diameter, a step of forming a ceramic coating precursor layer on a part of the electrode precursor layer and a step of firing the resulting precursor, and in this process, it is preferable to form the ceramic coating layer so as to cover the electrode layer on a predetermined cutting line of the firing product. According to the element-mounting substrate of the invention in which a part of the electrode layer is covered with a ceramic, a failure in mounting an element attributable to the thickness of the ceramic coating layer can be prevented when the element is mounted, and besides, peeling or cracking of the electrode layer due to an impact given in the dicing can be prevented.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DEVICES USING STIMULATED EMISSION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | ELEMENT MOUNTING SUBSTRATE AND METHOD FOR MANUFACTURING SAME |
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