NONDESTRUCTIVE RELIABILITY MONITORING METHOD FOR ADHESIVELY BONDED STRUCTURES WHOSE SENSITIVITY IS IMPROVED BY USING PIEZOELECTRIC MATERIALS

A method is disclosed for testing bonded part integrity of bonded structures with increased sensitivity and in a nondestructive manner. The method includes the steps of: mixing a piezoelectric material or an electrically conductive material with an adhesive agent, curing the adhesive agent in betwee...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIM, BYUNGUL, CHIN, WOO-SEOK, KWON, JAE-WOOK, HWANG, HUI-YUN, LEE, DAI-GIL, LEE, SEUNG-MIN HA
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS TESTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!