Board construction assembly for reducing sound transmission and method

An underlayment for supplementing one or more mechanical properties of conventional wall, ceiling, or floor board is used to in a wall, ceiling, or floor assembly that may be fabricated on site. The assembly includes a first and second wall, ceiling, or floor boards which each have mechanical proper...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SCHEERLINCK, PHILIPPE M, BABINEAU, FRANCIS JOHN, SWALES, TIMOTHY G, HUGH, MAYLENE KAY
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BUILDING CEILINGS FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS FIXED CONSTRUCTIONS FLOORS GENERAL BUILDING CONSTRUCTIONS INSULATION OR OTHER PROTECTION OF BUILDINGS ROOFS WALLS, e.g. PARTITIONS
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