Method for slurry cleaning of etch chambers
Described are methods of cleaning debris from semiconductor etch chambers or chamber components, one method comprising directing atomized abrasive slurry onto at least some internal surfaces of such a chamber or chamber components. Apparatus for carrying out the methods are also described.
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| creator | LAUBE, DAVID PAUL DAVIS, IAN MARTIN |
| description | Described are methods of cleaning debris from semiconductor etch chambers or chamber components, one method comprising directing atomized abrasive slurry onto at least some internal surfaces of such a chamber or chamber components. Apparatus for carrying out the methods are also described. |
| format | Patent |
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| language | eng ; fre ; ger |
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| subjects | ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GRINDING INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING |
| title | Method for slurry cleaning of etch chambers |
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