Tin electroplating solution and tin electroplating method

Tin electroplating solution and tin electroplating method

To provide a tin electroplating solution devoid of harmful lead and having excellent solder wettability, and a method for depositing a tin film on electronic parts using such a tin electroplating solution. The tin electroplating solution includes organic acids, a naphtholsulfonic acid and, as needed...

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Hauptverfasser: IMANARI, MASAAKI, TAKIZAWA, YASUSHI
Format: Patent
Sprache:eng ; fre ; ger
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APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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creator IMANARI, MASAAKI
TAKIZAWA, YASUSHI
description To provide a tin electroplating solution devoid of harmful lead and having excellent solder wettability, and a method for depositing a tin film on electronic parts using such a tin electroplating solution. The tin electroplating solution includes organic acids, a naphtholsulfonic acid and, as needed, an antioxidant and a surfactant is disclosed.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP1754805A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP1754805A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP1754805A13</originalsourceid><addsrcrecordid>eNrjZLAMycxTSM1JTS4pyi_ISSzJzEtXKM7PKS3JzM9TSMxLUSjBlM9NLcnIT-FhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGuAYbmpiYWBqaOhsZEKAEAKjUu5Q</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Tin electroplating solution and tin electroplating method</title><source>esp@cenet</source><creator>IMANARI, MASAAKI ; TAKIZAWA, YASUSHI</creator><creatorcontrib>IMANARI, MASAAKI ; TAKIZAWA, YASUSHI</creatorcontrib><description>To provide a tin electroplating solution devoid of harmful lead and having excellent solder wettability, and a method for depositing a tin film on electronic parts using such a tin electroplating solution. The tin electroplating solution includes organic acids, a naphtholsulfonic acid and, as needed, an antioxidant and a surfactant is disclosed.</description><language>eng ; fre ; ger</language><subject>APPARATUS THEREFOR ; CHEMISTRY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20070221&amp;DB=EPODOC&amp;CC=EP&amp;NR=1754805A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20070221&amp;DB=EPODOC&amp;CC=EP&amp;NR=1754805A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>IMANARI, MASAAKI</creatorcontrib><creatorcontrib>TAKIZAWA, YASUSHI</creatorcontrib><title>Tin electroplating solution and tin electroplating method</title><description>To provide a tin electroplating solution devoid of harmful lead and having excellent solder wettability, and a method for depositing a tin film on electronic parts using such a tin electroplating solution. The tin electroplating solution includes organic acids, a naphtholsulfonic acid and, as needed, an antioxidant and a surfactant is disclosed.</description><subject>APPARATUS THEREFOR</subject><subject>CHEMISTRY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAMycxTSM1JTS4pyi_ISSzJzEtXKM7PKS3JzM9TSMxLUSjBlM9NLcnIT-FhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGuAYbmpiYWBqaOhsZEKAEAKjUu5Q</recordid><startdate>20070221</startdate><enddate>20070221</enddate><creator>IMANARI, MASAAKI</creator><creator>TAKIZAWA, YASUSHI</creator><scope>EVB</scope></search><sort><creationdate>20070221</creationdate><title>Tin electroplating solution and tin electroplating method</title><author>IMANARI, MASAAKI ; TAKIZAWA, YASUSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP1754805A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2007</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMISTRY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>IMANARI, MASAAKI</creatorcontrib><creatorcontrib>TAKIZAWA, YASUSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>IMANARI, MASAAKI</au><au>TAKIZAWA, YASUSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Tin electroplating solution and tin electroplating method</title><date>2007-02-21</date><risdate>2007</risdate><abstract>To provide a tin electroplating solution devoid of harmful lead and having excellent solder wettability, and a method for depositing a tin film on electronic parts using such a tin electroplating solution. The tin electroplating solution includes organic acids, a naphtholsulfonic acid and, as needed, an antioxidant and a surfactant is disclosed.</abstract><oa>free_for_read</oa></addata></record>
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subjects APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
title Tin electroplating solution and tin electroplating method
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-30T22%3A52%3A51IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=IMANARI,%20MASAAKI&rft.date=2007-02-21&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP1754805A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true