Semiconductor module and semiconductor module heat radiation plate

In a semiconductor module (10) in which a semiconductor device (17) is mounted on both surfaces of a circuit board (11) and heat radiation plates (12a,12b) are provided to both surfaces of the circuit board to cover the semiconductor device, a fitting hole via which the heat radiation plates (12a,12...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	AOKI, SYUZO, UEHARA, SUMIO
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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