METHODS FOR IMPROVING FLOW THROUGH FLUIDIC CHANNELS
A method for improving fluidic flow for a microfluidic device having a through hole or slot therein. The method includes the steps of forming one or more openings through at least part of a thickness of a substrate from a first surface to an opposite second surface using a reactive ion etching proce...
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| creator | MRVOS, JAMES, M MONEY, CHRISTOPHER, J MCNEES, ANDREW, L VANDERPOOL, JASON, T HAMMOND, CORY, N KARTHIK, VAIDEESWARAN PATIL, GIRISH, S WILLIAMS, GARY, R WARNER, RICHARD, L KRAWCZYK, JOHN, W DOERRE, MARK, L |
| description | A method for improving fluidic flow for a microfluidic device having a through hole or slot therein. The method includes the steps of forming one or more openings through at least part of a thickness of a substrate from a first surface to an opposite second surface using a reactive ion etching process whereby an etch stop layer is applied to side wall surfaces in the one or more openings during alternating etching and passivating steps as the openings are etched through at least a portion of the substrate. Substantially all of the etch stop layer coating is removed from the side wall surfaces by treating the side wall surfaces using a method selected from chemical treatment and mechanical treatment, whereby a surface energy of the treated side wall surfaces is increased relative to a surface energy of the side wall surfaces containing the etch stop layer coating. |
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The method includes the steps of forming one or more openings through at least part of a thickness of a substrate from a first surface to an opposite second surface using a reactive ion etching process whereby an etch stop layer is applied to side wall surfaces in the one or more openings during alternating etching and passivating steps as the openings are etched through at least a portion of the substrate. Substantially all of the etch stop layer coating is removed from the side wall surfaces by treating the side wall surfaces using a method selected from chemical treatment and mechanical treatment, whereby a surface energy of the treated side wall surfaces is increased relative to a surface energy of the side wall surfaces containing the etch stop layer coating.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS CORRECTION OF TYPOGRAPHICAL ERRORS i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES MEASURING MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PHYSICS PRINTING SELECTIVE PRINTING MECHANISMS STAMPS TARIFF METERING APPARATUS TESTING TRANSPORTING TYPEWRITERS |
| title | METHODS FOR IMPROVING FLOW THROUGH FLUIDIC CHANNELS |
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