SANDWICHED THERMAL SOLUTION
A thermal solution (10) for an electronic device, which is positioned between a heat source (100) and an external surface of the electronic device and/or another component of the electronic device, where the thermal solution (10) facilitates heat dissipation from the heat source (100) while shieldin...
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| creator | TOZAWA, Masaaki FUJIWARA, Kikuo NORLEY, Julian SHIVES, Gary, D REYNOLDS, Robert, Anderson, III |
| description | A thermal solution (10) for an electronic device, which is positioned between a heat source (100) and an external surface of the electronic device and/or another component of the electronic device, where the thermal solution (10) facilitates heat dissipation from the heat source (100) while shielding the external surface and/or second component from the heat generated by the heat source (100). |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP1680274B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP1680274B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP1680274B13</originalsourceid><addsrcrecordid>eNrjZJAOdvRzCfd09nB1UQjxcA3ydfRRCPb3CQ3x9PfjYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgGGZhYGRuYmTobGRCgBACFiIEg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SANDWICHED THERMAL SOLUTION</title><source>esp@cenet</source><creator>TOZAWA, Masaaki ; FUJIWARA, Kikuo ; NORLEY, Julian ; SHIVES, Gary, D ; REYNOLDS, Robert, Anderson, III</creator><creatorcontrib>TOZAWA, Masaaki ; FUJIWARA, Kikuo ; NORLEY, Julian ; SHIVES, Gary, D ; REYNOLDS, Robert, Anderson, III</creatorcontrib><description>A thermal solution (10) for an electronic device, which is positioned between a heat source (100) and an external surface of the electronic device and/or another component of the electronic device, where the thermal solution (10) facilitates heat dissipation from the heat source (100) while shielding the external surface and/or second component from the heat generated by the heat source (100).</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEAT EXCHANGE IN GENERAL ; HEATING ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; LIGHTING ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MECHANICAL ENGINEERING ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; TRANSPORTING ; WEAPONS</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180926&DB=EPODOC&CC=EP&NR=1680274B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25547,76298</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180926&DB=EPODOC&CC=EP&NR=1680274B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TOZAWA, Masaaki</creatorcontrib><creatorcontrib>FUJIWARA, Kikuo</creatorcontrib><creatorcontrib>NORLEY, Julian</creatorcontrib><creatorcontrib>SHIVES, Gary, D</creatorcontrib><creatorcontrib>REYNOLDS, Robert, Anderson, III</creatorcontrib><title>SANDWICHED THERMAL SOLUTION</title><description>A thermal solution (10) for an electronic device, which is positioned between a heat source (100) and an external surface of the electronic device and/or another component of the electronic device, where the thermal solution (10) facilitates heat dissipation from the heat source (100) while shielding the external surface and/or second component from the heat generated by the heat source (100).</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEAT EXCHANGE IN GENERAL</subject><subject>HEATING</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>LIGHTING</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MECHANICAL ENGINEERING</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAOdvRzCfd09nB1UQjxcA3ydfRRCPb3CQ3x9PfjYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgGGZhYGRuYmTobGRCgBACFiIEg</recordid><startdate>20180926</startdate><enddate>20180926</enddate><creator>TOZAWA, Masaaki</creator><creator>FUJIWARA, Kikuo</creator><creator>NORLEY, Julian</creator><creator>SHIVES, Gary, D</creator><creator>REYNOLDS, Robert, Anderson, III</creator><scope>EVB</scope></search><sort><creationdate>20180926</creationdate><title>SANDWICHED THERMAL SOLUTION</title><author>TOZAWA, Masaaki ; FUJIWARA, Kikuo ; NORLEY, Julian ; SHIVES, Gary, D ; REYNOLDS, Robert, Anderson, III</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP1680274B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEAT EXCHANGE IN GENERAL</topic><topic>HEATING</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>LIGHTING</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MECHANICAL ENGINEERING</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>TOZAWA, Masaaki</creatorcontrib><creatorcontrib>FUJIWARA, Kikuo</creatorcontrib><creatorcontrib>NORLEY, Julian</creatorcontrib><creatorcontrib>SHIVES, Gary, D</creatorcontrib><creatorcontrib>REYNOLDS, Robert, Anderson, III</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TOZAWA, Masaaki</au><au>FUJIWARA, Kikuo</au><au>NORLEY, Julian</au><au>SHIVES, Gary, D</au><au>REYNOLDS, Robert, Anderson, III</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SANDWICHED THERMAL SOLUTION</title><date>2018-09-26</date><risdate>2018</risdate><abstract>A thermal solution (10) for an electronic device, which is positioned between a heat source (100) and an external surface of the electronic device and/or another component of the electronic device, where the thermal solution (10) facilitates heat dissipation from the heat source (100) while shielding the external surface and/or second component from the heat generated by the heat source (100).</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEATING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TRANSPORTING WEAPONS |
| title | SANDWICHED THERMAL SOLUTION |
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