Semiconductor circuit arrangement with energy recovery
The arrangement has a thermally conductive ceramic plate (2) electrically insulated from integrated semiconductor circuit units and coupled to a chip. A series connection (5) of Seebeck-units is provided on a side of the plate that is turned away from the plate and has heat contact areas that are th...
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creator | ROESEN, BENEDIKT HUELSKEMPER, MICHAEL BRAAM, REINHOLD SERAJL, GHOLAM ALI |
description | The arrangement has a thermally conductive ceramic plate (2) electrically insulated from integrated semiconductor circuit units and coupled to a chip. A series connection (5) of Seebeck-units is provided on a side of the plate that is turned away from the plate and has heat contact areas that are thermally coupled with the plate and a heat reservoir, respectively. Electric contacts pick up thermal voltages supplied from the connection. The plate is coupled to the chip by heat conducting units. An independent claim is also included for a combination of a semiconductor circuit arrangement and a battery. |
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A series connection (5) of Seebeck-units is provided on a side of the plate that is turned away from the plate and has heat contact areas that are thermally coupled with the plate and a heat reservoir, respectively. Electric contacts pick up thermal voltages supplied from the connection. The plate is coupled to the chip by heat conducting units. An independent claim is also included for a combination of a semiconductor circuit arrangement and a battery.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060614&DB=EPODOC&CC=EP&NR=1670077A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060614&DB=EPODOC&CC=EP&NR=1670077A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ROESEN, BENEDIKT</creatorcontrib><creatorcontrib>HUELSKEMPER, MICHAEL</creatorcontrib><creatorcontrib>BRAAM, REINHOLD</creatorcontrib><creatorcontrib>SERAJL, GHOLAM ALI</creatorcontrib><title>Semiconductor circuit arrangement with energy recovery</title><description>The arrangement has a thermally conductive ceramic plate (2) electrically insulated from integrated semiconductor circuit units and coupled to a chip. 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A series connection (5) of Seebeck-units is provided on a side of the plate that is turned away from the plate and has heat contact areas that are thermally coupled with the plate and a heat reservoir, respectively. Electric contacts pick up thermal voltages supplied from the connection. The plate is coupled to the chip by heat conducting units. An independent claim is also included for a combination of a semiconductor circuit arrangement and a battery.</abstract><oa>free_for_read</oa></addata></record> |
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language | eng ; fre ; ger |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Semiconductor circuit arrangement with energy recovery |
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