IMPROVED METHOD FOR MICRO-ROUGHENING TREATMENT OF COPPER AND MIXED-METAL CIRCUITRY

Process to improve adhesion of dielectric materials to a metal layer, including providing an unpatterned metal layer having a first major surface; micro-roughening the first major surface to form a micro-roughened surface; and etching the metal layer to form a circuit pattern in the metal layer, in...

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Hauptverfasser:	FUERHAUPTER, HARRY, JOHAL, KULDIP, SINGH, BARON, DAVID, THOMAS, BROOKS, PATRICK, PAUL
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PRINTED CIRCUITS
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creator	FUERHAUPTER, HARRY JOHAL, KULDIP, SINGH BARON, DAVID, THOMAS BROOKS, PATRICK, PAUL
description	Process to improve adhesion of dielectric materials to a metal layer, including providing an unpatterned metal layer having a first major surface; micro-roughening the first major surface to form a micro-roughened surface; and etching the metal layer to form a circuit pattern in the metal layer, in which the micro-roughening is carried out prior to the etching.
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fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP1668967A2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP1668967A2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP1668967A23</originalsourceid><addsrcrecordid>eNqNy7EKwjAQgOEsDqK-w71ABhWqjiG5NAGTC8dVdCpF4iRaqO-PHXwAp3_5v6XimArTBR0klEAOPDGkaJk0U9cGzDG3IIxGEmYB8mCpFGQweTbxik7P0pzBRrZdFL6t1eIxPKe6-XWlwKPYoOv47us0Dvf6qp8ey7ZpjqfmYHb7P5Yvjeovfg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>IMPROVED METHOD FOR MICRO-ROUGHENING TREATMENT OF COPPER AND MIXED-METAL CIRCUITRY</title><source>esp@cenet</source><creator>FUERHAUPTER, HARRY ; JOHAL, KULDIP, SINGH ; BARON, DAVID, THOMAS ; BROOKS, PATRICK, PAUL</creator><creatorcontrib>FUERHAUPTER, HARRY ; JOHAL, KULDIP, SINGH ; BARON, DAVID, THOMAS ; BROOKS, PATRICK, PAUL</creatorcontrib><description>Process to improve adhesion of dielectric materials to a metal layer, including providing an unpatterned metal layer having a first major surface; micro-roughening the first major surface to form a micro-roughened surface; and etching the metal layer to form a circuit pattern in the metal layer, in which the micro-roughening is carried out prior to the etching.</description><edition>7</edition><language>eng ; fre ; ger</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 ; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE ; PRINTED CIRCUITS</subject><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060614&DB=EPODOC&CC=EP&NR=1668967A2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060614&DB=EPODOC&CC=EP&NR=1668967A2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FUERHAUPTER, HARRY</creatorcontrib><creatorcontrib>JOHAL, KULDIP, SINGH</creatorcontrib><creatorcontrib>BARON, DAVID, THOMAS</creatorcontrib><creatorcontrib>BROOKS, PATRICK, PAUL</creatorcontrib><title>IMPROVED METHOD FOR MICRO-ROUGHENING TREATMENT OF COPPER AND MIXED-METAL CIRCUITRY</title><description>Process to improve adhesion of dielectric materials to a metal layer, including providing an unpatterned metal layer having a first major surface; micro-roughening the first major surface to form a micro-roughened surface; and etching the metal layer to form a circuit pattern in the metal layer, in which the micro-roughening is carried out prior to the etching.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</subject><subject>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNy7EKwjAQgOEsDqK-w71ABhWqjiG5NAGTC8dVdCpF4iRaqO-PHXwAp3_5v6XimArTBR0klEAOPDGkaJk0U9cGzDG3IIxGEmYB8mCpFGQweTbxik7P0pzBRrZdFL6t1eIxPKe6-XWlwKPYoOv47us0Dvf6qp8ey7ZpjqfmYHb7P5Yvjeovfg</recordid><startdate>20060614</startdate><enddate>20060614</enddate><creator>FUERHAUPTER, HARRY</creator><creator>JOHAL, KULDIP, SINGH</creator><creator>BARON, DAVID, THOMAS</creator><creator>BROOKS, PATRICK, PAUL</creator><scope>EVB</scope></search><sort><creationdate>20060614</creationdate><title>IMPROVED METHOD FOR MICRO-ROUGHENING TREATMENT OF COPPER AND MIXED-METAL CIRCUITRY</title><author>FUERHAUPTER, HARRY ; JOHAL, KULDIP, SINGH ; BARON, DAVID, THOMAS ; BROOKS, PATRICK, PAUL</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP1668967A23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2006</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</topic><topic>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>FUERHAUPTER, HARRY</creatorcontrib><creatorcontrib>JOHAL, KULDIP, SINGH</creatorcontrib><creatorcontrib>BARON, DAVID, THOMAS</creatorcontrib><creatorcontrib>BROOKS, PATRICK, PAUL</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FUERHAUPTER, HARRY</au><au>JOHAL, KULDIP, SINGH</au><au>BARON, DAVID, THOMAS</au><au>BROOKS, PATRICK, PAUL</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>IMPROVED METHOD FOR MICRO-ROUGHENING TREATMENT OF COPPER AND MIXED-METAL CIRCUITRY</title><date>2006-06-14</date><risdate>2006</risdate><abstract>Process to improve adhesion of dielectric materials to a metal layer, including providing an unpatterned metal layer having a first major surface; micro-roughening the first major surface to form a micro-roughened surface; and etching the metal layer to form a circuit pattern in the metal layer, in which the micro-roughening is carried out prior to the etching.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
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language	eng ; fre ; ger
recordid	cdi_epo_espacenet_EP1668967A2
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subjects	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PRINTED CIRCUITS
title	IMPROVED METHOD FOR MICRO-ROUGHENING TREATMENT OF COPPER AND MIXED-METAL CIRCUITRY
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