Method for metallizing an electric component on a flexible circuit support and flexible circuit support with an electric component metallized thereon

The method of forming a contact between at least one electric component (10) and a flexible circuit carrier or board (12) involves forming a wire bond connection between a contact of the component and a contact surface on the flexible substrate. The wire bond connection may be formed using ultrasoni...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	BERGHAUS, HARALD, KORTWIG, CARSTEN, EDER, BERND
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The method of forming a contact between at least one electric component (10) and a flexible circuit carrier or board (12) involves forming a wire bond connection between a contact of the component and a contact surface on the flexible substrate. The wire bond connection may be formed using ultrasonic bonding techniques. Independent claims also cover apparatus for carrying out the method and a flexible circuit carrier. Bei einem Verfahren zur Kontaktierung wenigstens eines elektrischen Bauelements auf einem flexiblen Schaltungsträger wird zwischen wenigstens einem Bauelementkontakt des Bauelements und wenigstens einer Kontaktfläche auf dem flexiblen Schaltungsträger eine Drahtbondverbindung hergestellt.