SCATTEROMETRY ALIGNMENT FOR IMPRINT LITHOGRAPHY

Described are methods for patterning a substrate by imprint lithography. Imprint lithography is a process in which a liquid is dispensed onto a substrate. A template is brought into contact with the liquid and the liquid is cured. The cured liquid includes an imprint of any patterns formed in the te...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: WATTS, MICHAEL, P.C, SREENIVASAN, SIDLGATA, V, MCMACKIN, IAN, VOISIN, RONALD, D, SCHUMAKER, NORMAN, E, CHOI, BYUNG-JIN
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator WATTS, MICHAEL, P.C
SREENIVASAN, SIDLGATA, V
MCMACKIN, IAN
VOISIN, RONALD, D
SCHUMAKER, NORMAN, E
CHOI, BYUNG-JIN
description Described are methods for patterning a substrate by imprint lithography. Imprint lithography is a process in which a liquid is dispensed onto a substrate. A template is brought into contact with the liquid and the liquid is cured. The cured liquid includes an imprint of any patterns formed in the template. Alignment of the template with a previously formed layer on a substrate, in one embodiment, is accomplished by using scatterometry.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP1573395A4</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP1573395A4</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP1573395A43</originalsourceid><addsrcrecordid>eNrjZNAPdnYMCXEN8vd1DQmKVHD08XT383X1C1Fw8w9S8PQNCPIEsn08Qzz83YMcAzwieRhY0xJzilN5oTQ3g4Kba4izh25qQX58anFBYnJqXmpJvGuAoam5sbGlqaOJMRFKAPkSJjA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SCATTEROMETRY ALIGNMENT FOR IMPRINT LITHOGRAPHY</title><source>esp@cenet</source><creator>WATTS, MICHAEL, P.C ; SREENIVASAN, SIDLGATA, V ; MCMACKIN, IAN ; VOISIN, RONALD, D ; SCHUMAKER, NORMAN, E ; CHOI, BYUNG-JIN</creator><creatorcontrib>WATTS, MICHAEL, P.C ; SREENIVASAN, SIDLGATA, V ; MCMACKIN, IAN ; VOISIN, RONALD, D ; SCHUMAKER, NORMAN, E ; CHOI, BYUNG-JIN</creatorcontrib><description>Described are methods for patterning a substrate by imprint lithography. Imprint lithography is a process in which a liquid is dispensed onto a substrate. A template is brought into contact with the liquid and the liquid is cured. The cured liquid includes an imprint of any patterns formed in the template. Alignment of the template with a previously formed layer on a substrate, in one embodiment, is accomplished by using scatterometry.</description><language>eng ; fre ; ger</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CINEMATOGRAPHY ; ELECTROGRAPHY ; HOLOGRAPHY ; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MATERIALS THEREFOR ; MEASURING ; MEASURING ANGLES ; MEASURING AREAS ; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS ; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; TESTING</subject><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20100929&amp;DB=EPODOC&amp;CC=EP&amp;NR=1573395A4$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20100929&amp;DB=EPODOC&amp;CC=EP&amp;NR=1573395A4$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WATTS, MICHAEL, P.C</creatorcontrib><creatorcontrib>SREENIVASAN, SIDLGATA, V</creatorcontrib><creatorcontrib>MCMACKIN, IAN</creatorcontrib><creatorcontrib>VOISIN, RONALD, D</creatorcontrib><creatorcontrib>SCHUMAKER, NORMAN, E</creatorcontrib><creatorcontrib>CHOI, BYUNG-JIN</creatorcontrib><title>SCATTEROMETRY ALIGNMENT FOR IMPRINT LITHOGRAPHY</title><description>Described are methods for patterning a substrate by imprint lithography. Imprint lithography is a process in which a liquid is dispensed onto a substrate. A template is brought into contact with the liquid and the liquid is cured. The cured liquid includes an imprint of any patterns formed in the template. Alignment of the template with a previously formed layer on a substrate, in one embodiment, is accomplished by using scatterometry.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MATERIALS THEREFOR</subject><subject>MEASURING</subject><subject>MEASURING ANGLES</subject><subject>MEASURING AREAS</subject><subject>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</subject><subject>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2010</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAPdnYMCXEN8vd1DQmKVHD08XT383X1C1Fw8w9S8PQNCPIEsn08Qzz83YMcAzwieRhY0xJzilN5oTQ3g4Kba4izh25qQX58anFBYnJqXmpJvGuAoam5sbGlqaOJMRFKAPkSJjA</recordid><startdate>20100929</startdate><enddate>20100929</enddate><creator>WATTS, MICHAEL, P.C</creator><creator>SREENIVASAN, SIDLGATA, V</creator><creator>MCMACKIN, IAN</creator><creator>VOISIN, RONALD, D</creator><creator>SCHUMAKER, NORMAN, E</creator><creator>CHOI, BYUNG-JIN</creator><scope>EVB</scope></search><sort><creationdate>20100929</creationdate><title>SCATTEROMETRY ALIGNMENT FOR IMPRINT LITHOGRAPHY</title><author>WATTS, MICHAEL, P.C ; SREENIVASAN, SIDLGATA, V ; MCMACKIN, IAN ; VOISIN, RONALD, D ; SCHUMAKER, NORMAN, E ; CHOI, BYUNG-JIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP1573395A43</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2010</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MATERIALS THEREFOR</topic><topic>MEASURING</topic><topic>MEASURING ANGLES</topic><topic>MEASURING AREAS</topic><topic>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</topic><topic>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>WATTS, MICHAEL, P.C</creatorcontrib><creatorcontrib>SREENIVASAN, SIDLGATA, V</creatorcontrib><creatorcontrib>MCMACKIN, IAN</creatorcontrib><creatorcontrib>VOISIN, RONALD, D</creatorcontrib><creatorcontrib>SCHUMAKER, NORMAN, E</creatorcontrib><creatorcontrib>CHOI, BYUNG-JIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WATTS, MICHAEL, P.C</au><au>SREENIVASAN, SIDLGATA, V</au><au>MCMACKIN, IAN</au><au>VOISIN, RONALD, D</au><au>SCHUMAKER, NORMAN, E</au><au>CHOI, BYUNG-JIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SCATTEROMETRY ALIGNMENT FOR IMPRINT LITHOGRAPHY</title><date>2010-09-29</date><risdate>2010</risdate><abstract>Described are methods for patterning a substrate by imprint lithography. Imprint lithography is a process in which a liquid is dispensed onto a substrate. A template is brought into contact with the liquid and the liquid is cured. The cured liquid includes an imprint of any patterns formed in the template. Alignment of the template with a previously formed layer on a substrate, in one embodiment, is accomplished by using scatterometry.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng ; fre ; ger
recordid cdi_epo_espacenet_EP1573395A4
source esp@cenet
subjects APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MATERIALS THEREFOR
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
TESTING
title SCATTEROMETRY ALIGNMENT FOR IMPRINT LITHOGRAPHY
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-18T17%3A04%3A22IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=WATTS,%20MICHAEL,%20P.C&rft.date=2010-09-29&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP1573395A4%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true