HIGH-DENSITY INTERCONNECTION OF TEMPERATURE SENSITIVE ELECTRONIC DEVICES
Techniques for interconnecting high-density, structures that include temperature sensitive materials such as piezoelectric ultrasonic transducer arrays, optical detector arrays, MEMS and the like to other structures (e.g., integrated circuits or mechanical assemblies) are disclosed.
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| creator | ERIKSON, KENNETH, R MARCINIEC, JOHN, W |
| description | Techniques for interconnecting high-density, structures that include temperature sensitive materials such as piezoelectric ultrasonic transducer arrays, optical detector arrays, MEMS and the like to other structures (e.g., integrated circuits or mechanical assemblies) are disclosed. |
| format | Patent |
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| language | eng ; fre ; ger |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING |
| title | HIGH-DENSITY INTERCONNECTION OF TEMPERATURE SENSITIVE ELECTRONIC DEVICES |
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