HIGH FREQUENCY SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
A semiconductor device (10) having a gate (15), a source (19), and a drain (20) with a gate bus (25) and first ground shield (24) patterned from a first metal layer and a second ground shield (31) patterned from a second metal layer. The first ground shield (24) and the second ground shield (31) low...
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creator | DRAGON, CHRISTOPHER, P BURGER, WAYNE, R LAMEY, DANIEL, J |
description | A semiconductor device (10) having a gate (15), a source (19), and a drain (20) with a gate bus (25) and first ground shield (24) patterned from a first metal layer and a second ground shield (31) patterned from a second metal layer. The first ground shield (24) and the second ground shield (31) lower the capacitance of device (10) making it suitable for high frequency applications and housing in a plastic package. |
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The first ground shield (24) and the second ground shield (31) lower the capacitance of device (10) making it suitable for high frequency applications and housing in a plastic package.</description><edition>7</edition><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2004</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20041124&DB=EPODOC&CC=EP&NR=1479110A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20041124&DB=EPODOC&CC=EP&NR=1479110A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DRAGON, CHRISTOPHER, P</creatorcontrib><creatorcontrib>BURGER, WAYNE, R</creatorcontrib><creatorcontrib>LAMEY, DANIEL, J</creatorcontrib><title>HIGH FREQUENCY SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE</title><description>A semiconductor device (10) having a gate (15), a source (19), and a drain (20) with a gate bus (25) and first ground shield (24) patterned from a first metal layer and a second ground shield (31) patterned from a second metal layer. The first ground shield (24) and the second ground shield (31) lower the capacitance of device (10) making it suitable for high frequency applications and housing in a plastic package.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2004</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLD18HT3UHALcg0MdfVzjlQIdvX1dPb3cwl1DvEPUnBxDfN0dlVw9HNR8HUN8fB3UfB3U_B19At1c3QOCQ1y5WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BhibmloaGBo6GxkQoAQDa8Slf</recordid><startdate>20041124</startdate><enddate>20041124</enddate><creator>DRAGON, CHRISTOPHER, P</creator><creator>BURGER, WAYNE, R</creator><creator>LAMEY, DANIEL, J</creator><scope>EVB</scope></search><sort><creationdate>20041124</creationdate><title>HIGH FREQUENCY SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE</title><author>DRAGON, CHRISTOPHER, P ; BURGER, WAYNE, R ; LAMEY, DANIEL, J</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP1479110A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2004</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>DRAGON, CHRISTOPHER, P</creatorcontrib><creatorcontrib>BURGER, WAYNE, R</creatorcontrib><creatorcontrib>LAMEY, DANIEL, J</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>DRAGON, CHRISTOPHER, P</au><au>BURGER, WAYNE, R</au><au>LAMEY, DANIEL, J</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HIGH FREQUENCY SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE</title><date>2004-11-24</date><risdate>2004</risdate><abstract>A semiconductor device (10) having a gate (15), a source (19), and a drain (20) with a gate bus (25) and first ground shield (24) patterned from a first metal layer and a second ground shield (31) patterned from a second metal layer. The first ground shield (24) and the second ground shield (31) lower the capacitance of device (10) making it suitable for high frequency applications and housing in a plastic package.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | HIGH FREQUENCY SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE |
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