Electronic package with strengthened conductive pad

An electronic package and information handling system utilizing same wherein the package substrate (11') includes an internally conductive layer (15') coupled to an external pad (13') and of a size sufficiently large enough to substantially prevent cracking, separation, etc. of the pa...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	ALCOE, DAVID
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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