INTERMEDIATE SUPPORT FOR ELECTRONIC COMPONENTS AND METHOD FOR SOLDER CONTACTING SUCH AN INTERMEDIATE SUPPORT
The invention relates to an intermediate support for electronic components, for example a semiconductor, comprising a plastic substrate with contact bumps (2) in one-piece, covered with a metallic layer, which is electrically connected to at least one conducting path of said substrate (1). Said cont...
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| creator | VAN PUYMBROECK, JOZEF HEERMAN, MARCEL |
| description | The invention relates to an intermediate support for electronic components, for example a semiconductor, comprising a plastic substrate with contact bumps (2) in one-piece, covered with a metallic layer, which is electrically connected to at least one conducting path of said substrate (1). Said contact bumps (2) each comprise a well wettable path, extending from the tips to the base thereof and each leading to the corresponding contact bump (2) base in a solder receiving region with suction (11). Therefore, by soldering said contact bumps, excess solder can be sucked off, such that short circuits can be avoided even without the use of a solder resist. By solder contacting said intermediate support, the solder can thus be applied over a large surface on a circuit support and sucked off the cavities between the contact points by reflow soldering. |
| format | Patent |
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Said contact bumps (2) each comprise a well wettable path, extending from the tips to the base thereof and each leading to the corresponding contact bump (2) base in a solder receiving region with suction (11). Therefore, by soldering said contact bumps, excess solder can be sucked off, such that short circuits can be avoided even without the use of a solder resist. 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Said contact bumps (2) each comprise a well wettable path, extending from the tips to the base thereof and each leading to the corresponding contact bump (2) base in a solder receiving region with suction (11). Therefore, by soldering said contact bumps, excess solder can be sucked off, such that short circuits can be avoided even without the use of a solder resist. By solder contacting said intermediate support, the solder can thus be applied over a large surface on a circuit support and sucked off the cavities between the contact points by reflow soldering.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2004</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNzLEKwjAQgOEsDqK-w72Ag1ERx5BcTaC5C-k5lyJxKlqo749BHB2c_uXjX6oxkGCO6IIRhO6aEmeBhjNgi1YyU7BgOSYmJOnAkIOI4tl9UMetw1wBibES6FIX1lcFv75rtbgP41w2364UNCjWb8v07Ms8DbfyKK8e0-6gj6ezNnr_B3kD07I2zg</recordid><startdate>20040609</startdate><enddate>20040609</enddate><creator>VAN PUYMBROECK, JOZEF</creator><creator>HEERMAN, MARCEL</creator><scope>EVB</scope></search><sort><creationdate>20040609</creationdate><title>INTERMEDIATE SUPPORT FOR ELECTRONIC COMPONENTS AND METHOD FOR SOLDER CONTACTING SUCH AN INTERMEDIATE SUPPORT</title><author>VAN PUYMBROECK, JOZEF ; HEERMAN, MARCEL</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP1425792A23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2004</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>VAN PUYMBROECK, JOZEF</creatorcontrib><creatorcontrib>HEERMAN, MARCEL</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>VAN PUYMBROECK, JOZEF</au><au>HEERMAN, MARCEL</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>INTERMEDIATE SUPPORT FOR ELECTRONIC COMPONENTS AND METHOD FOR SOLDER CONTACTING SUCH AN INTERMEDIATE SUPPORT</title><date>2004-06-09</date><risdate>2004</risdate><abstract>The invention relates to an intermediate support for electronic components, for example a semiconductor, comprising a plastic substrate with contact bumps (2) in one-piece, covered with a metallic layer, which is electrically connected to at least one conducting path of said substrate (1). Said contact bumps (2) each comprise a well wettable path, extending from the tips to the base thereof and each leading to the corresponding contact bump (2) base in a solder receiving region with suction (11). Therefore, by soldering said contact bumps, excess solder can be sucked off, such that short circuits can be avoided even without the use of a solder resist. By solder contacting said intermediate support, the solder can thus be applied over a large surface on a circuit support and sucked off the cavities between the contact points by reflow soldering.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | INTERMEDIATE SUPPORT FOR ELECTRONIC COMPONENTS AND METHOD FOR SOLDER CONTACTING SUCH AN INTERMEDIATE SUPPORT |
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