CMOS image sensor using gradient index chip scale lenses

A camera module (100, 200) includes a gradient index lens (160) on a spacer plate (150) attached over an array of pixel sensors (120) and associated micro lenses (130, 230). The spacer plate (150) and gradient index lens (160) can be formed at the wafer level during the manufacture of multiple camer...

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Hauptverfasser: PITOU, DAVID S, HARTLOVE, JASON T, JOHNSON, PATRICIA E
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creator PITOU, DAVID S
HARTLOVE, JASON T
JOHNSON, PATRICIA E
description A camera module (100, 200) includes a gradient index lens (160) on a spacer plate (150) attached over an array of pixel sensors (120) and associated micro lenses (130, 230). The spacer plate (150) and gradient index lens (160) can be formed at the wafer level during the manufacture of multiple camera modules (100, 200). A process for manufacturing the camera modules (100, 200) thus provides tolerances and yields provided by wafer processing techniques rather than mechanical assembly.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP1389804B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP1389804B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP1389804B13</originalsourceid><addsrcrecordid>eNrjZLBw9vUPVsjMTUxPVShOzSvOL1IoLc7MS1dIL0pMyUzNK1HIzEtJrVBIzsgsUChOTsxJVcgBKkst5mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BhsYWlhYGJk6GxkQoAQBiCy1c</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>CMOS image sensor using gradient index chip scale lenses</title><source>esp@cenet</source><creator>PITOU, DAVID S ; HARTLOVE, JASON T ; JOHNSON, PATRICIA E</creator><creatorcontrib>PITOU, DAVID S ; HARTLOVE, JASON T ; JOHNSON, PATRICIA E</creatorcontrib><description>A camera module (100, 200) includes a gradient index lens (160) on a spacer plate (150) attached over an array of pixel sensors (120) and associated micro lenses (130, 230). The spacer plate (150) and gradient index lens (160) can be formed at the wafer level during the manufacture of multiple camera modules (100, 200). A process for manufacturing the camera modules (100, 200) thus provides tolerances and yields provided by wafer processing techniques rather than mechanical assembly.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PHYSICS ; PICTORIAL COMMUNICATION, e.g. TELEVISION ; SEMICONDUCTOR DEVICES</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20110105&amp;DB=EPODOC&amp;CC=EP&amp;NR=1389804B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20110105&amp;DB=EPODOC&amp;CC=EP&amp;NR=1389804B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>PITOU, DAVID S</creatorcontrib><creatorcontrib>HARTLOVE, JASON T</creatorcontrib><creatorcontrib>JOHNSON, PATRICIA E</creatorcontrib><title>CMOS image sensor using gradient index chip scale lenses</title><description>A camera module (100, 200) includes a gradient index lens (160) on a spacer plate (150) attached over an array of pixel sensors (120) and associated micro lenses (130, 230). The spacer plate (150) and gradient index lens (160) can be formed at the wafer level during the manufacture of multiple camera modules (100, 200). A process for manufacturing the camera modules (100, 200) thus provides tolerances and yields provided by wafer processing techniques rather than mechanical assembly.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><subject>PICTORIAL COMMUNICATION, e.g. TELEVISION</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLBw9vUPVsjMTUxPVShOzSvOL1IoLc7MS1dIL0pMyUzNK1HIzEtJrVBIzsgsUChOTsxJVcgBKkst5mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BhsYWlhYGJk6GxkQoAQBiCy1c</recordid><startdate>20110105</startdate><enddate>20110105</enddate><creator>PITOU, DAVID S</creator><creator>HARTLOVE, JASON T</creator><creator>JOHNSON, PATRICIA E</creator><scope>EVB</scope></search><sort><creationdate>20110105</creationdate><title>CMOS image sensor using gradient index chip scale lenses</title><author>PITOU, DAVID S ; HARTLOVE, JASON T ; JOHNSON, PATRICIA E</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP1389804B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2011</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><topic>PICTORIAL COMMUNICATION, e.g. TELEVISION</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>PITOU, DAVID S</creatorcontrib><creatorcontrib>HARTLOVE, JASON T</creatorcontrib><creatorcontrib>JOHNSON, PATRICIA E</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>PITOU, DAVID S</au><au>HARTLOVE, JASON T</au><au>JOHNSON, PATRICIA E</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CMOS image sensor using gradient index chip scale lenses</title><date>2011-01-05</date><risdate>2011</risdate><abstract>A camera module (100, 200) includes a gradient index lens (160) on a spacer plate (150) attached over an array of pixel sensors (120) and associated micro lenses (130, 230). The spacer plate (150) and gradient index lens (160) can be formed at the wafer level during the manufacture of multiple camera modules (100, 200). A process for manufacturing the camera modules (100, 200) thus provides tolerances and yields provided by wafer processing techniques rather than mechanical assembly.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
PICTORIAL COMMUNICATION, e.g. TELEVISION
SEMICONDUCTOR DEVICES
title CMOS image sensor using gradient index chip scale lenses
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-13T21%3A28%3A07IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=PITOU,%20DAVID%20S&rft.date=2011-01-05&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP1389804B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true