Method for adjusting the overlay of two masking levels in a photolithographic process

The present invention provides a method for optimizing the overlay adjustment of two mask planes in a photolithographic process for the production of an integrated circuit having the following steps: provision of a substrate (S) with at least one first mask plane (ME), which has been patterned by ex...

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Bibliographische Detailangaben
1. Verfasser: HASSMANN, JENS
Format: Patent
Sprache:eng ; fre ; ger
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