Multilayer printed circuit board laminate and process for manufacturing the same
The method involves providing a circuit board blank (1) comprising a substrate (2) and at least one electrically conductive layer (3) of a thickness that is suitable for carrying power currents. The thickness of part of the conductive layer (3) is reduced to create a signal conduction layer. The con...
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| creator | KOPF, REINHOLD OPITZ, RUDI WALTER STUCKMANN, WALTER PAUL FRITZ |
| description | The method involves providing a circuit board blank (1) comprising a substrate (2) and at least one electrically conductive layer (3) of a thickness that is suitable for carrying power currents. The thickness of part of the conductive layer (3) is reduced to create a signal conduction layer. The conductive layer has a thickness DL, where 150 mumat mostDLapproximately600 mum, preferably DL400 mum. An Independent claim is included for a multilayer circuit board module. |
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| language | eng ; fre ; ger |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Multilayer printed circuit board laminate and process for manufacturing the same |
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