LIQUID THERMOSETTING RESIN COMPOSITION, PRINTED WIRING BOARDS AND PROCESS FOR THEIR PRODUCTION

A liquid thermosetting resin composition comprises (A) an epoxy resin, (B) a curing catalyst, and (C) a filler and is characterized by exhibiting a viscosity at 25° C. of not more than 1,500 dPa.s, a gel time of not less than 300 seconds at a temperature at which the composition exhibits a melt visc...

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Bibliographische Detailangaben
Hauptverfasser:	YODA, KYOICHI, WATANABE, YASUKAZU, TAKAHASHI, RIEKO, KIMURA, NORIO
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	A liquid thermosetting resin composition comprises (A) an epoxy resin, (B) a curing catalyst, and (C) a filler and is characterized by exhibiting a viscosity at 25° C. of not more than 1,500 dPa.s, a gel time of not less than 300 seconds at a temperature at which the composition exhibits a melt viscosity of not more than 10 dPa.s, and a gel time at 130° C. of not more than 600 seconds. In the production of a printed wiring board by superposing an interlaminar resin insulating layer and a conductive circuit on the surface of the wiring board having a conductive circuit pattern including hole parts, a hole filling process is performed by filling the hole parts mentioned above with the composition mentioned above, effecting precure of the composition by heating, then polishing and removing parts of the precured composition protruding from a surface defining the hole parts, and further heating the precured composition till final curing.