Surface-mount package for an optical sensing device

An optical sensor package (10) capable of being surface mounted, and in a form that enables multiple packages (10) to be fabricated simultaneously and then array tested in a wafer stack prior to singulation. The package (10) comprises a chip carrier (12), a device chip (16) electrically and mechanic...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BORZABADI, HAMID R, CHAVAN, ABHIJEET V, LOGSDON, JAMES H
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS COLORIMETRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT MEASURING PHYSICS RADIATION PYROMETRY SEMICONDUCTOR DEVICES TESTING
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