Waferlevel method for direct bumping on copper pads in integrated circuits

A structure and a fabrication method for metallurgical connections between solder bumps (509) and contact pads (501) positioned on integrated circuits (IC) having copper interconnecting metallization protected by an overcoat (503). The structure comprises a portion of the copper metallization expose...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SMITH, PATRICIA B, BOJKOV, CHRISTO P, COFFMAN, PHILLIP
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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