METHOD FOR ELECTRICALLY CONDUCTIVE BONDING BETWEEN TWO SEMICONDUCTOR ELEMENTS

A method of creating an electrically conducting bonding between a face of a first semiconductor element and a face of a second semiconductor element using heat treatment. The method applies the faces one against the other with the placing between them of at least one layer of a material configured t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MADAR, ROLAND, JAUSSAUD, CLAUDE, JALAGUIER, ERIC
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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