MULTICHIP MODULE AND METHOD FOR PRODUCING A MULTICHIP MODULE

MULTICHIP MODULE AND METHOD FOR PRODUCING A MULTICHIP MODULE

Multi-chip module comprises a base chip, a top chip, an adhesive layer, an electrically conducting planarizing layer, a through-hole and a contact structure. Multi-chip module comprises a base chip (10) having a passivating layer (12) and a connecting layer (14); a top chip having a passivating laye...

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Hauptverfasser: LANDESBERGER, CHRISTOF, ANSORGE, FRANK, EHRMANN, OSWIN, RAMM, PETER, REICHL, HERBERT
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator LANDESBERGER, CHRISTOF
ANSORGE, FRANK
EHRMANN, OSWIN
RAMM, PETER
REICHL, HERBERT
description Multi-chip module comprises a base chip, a top chip, an adhesive layer, an electrically conducting planarizing layer, a through-hole and a contact structure. Multi-chip module comprises a base chip (10) having a passivating layer (12) and a connecting layer (14); a top chip having a passivating layer (18) and a connecting layer (20); an adhesive layer (22) between the passivating layer (12) of the base chip and the lower side of the top chip and the top chip and the base chip; an electrically conducting planarizing layer (24) on the surface of the base chip and embedded in the top chip; a through-hole (26a) filled with electrically conducting material; and a contact structure (28, 30) to connect the electrically conducting material in the through-hole to the connecting surface of the top chip.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title MULTICHIP MODULE AND METHOD FOR PRODUCING A MULTICHIP MODULE
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