A capacitor for integration with copper damascene structure and manufacturing method

The present invention provides a capacitor for use in a semiconductor device having a damascene interconnect structure, such as a dual damascene interconnect, formed over a substrate of a semiconductor wafer. In one particularly advantageous embodiment, the capacitor, comprises a first capacitor ele...

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Bibliographische Detailangaben
Hauptverfasser: HARRIS, EDWARD BELDEN, MERCHANT, SAILESH MANSINH, DOWNEY, STEPHEN WARD
Format: Patent
Sprache:eng ; fre ; ger
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