LEAD FRAME ATTACHMENT FOR OPTOELECTRONIC DEVICE

LEAD FRAME ATTACHMENT FOR OPTOELECTRONIC DEVICE

An optoelectronic device is mounted on a planar substrate in electrical connection with solder bumps adjacent an edge of the substrate and connection to a lead frame is made by loading the edge of the substrate on a lead frame support with lead frame conductors in engagement with the solder bumps an...

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1. Verfasser: MAUND, BRIGG
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
SEMICONDUCTOR DEVICES
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creator MAUND, BRIGG
description An optoelectronic device is mounted on a planar substrate in electrical connection with solder bumps adjacent an edge of the substrate and connection to a lead frame is made by loading the edge of the substrate on a lead frame support with lead frame conductors in engagement with the solder bumps and applying heat to melt the solder.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP1101250A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP1101250A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP1101250A13</originalsourceid><addsrcrecordid>eNrjZND3cXV0UXALcvR1VXAMCXF09vB19QtRcPMPUvAPCPF39XF1Dgny9_N0VnBxDfN0duVhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGuAYaGBoZGpgaOhsZEKAEAq3MlXQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>LEAD FRAME ATTACHMENT FOR OPTOELECTRONIC DEVICE</title><source>esp@cenet</source><creator>MAUND, BRIGG</creator><creatorcontrib>MAUND, BRIGG</creatorcontrib><description>An optoelectronic device is mounted on a planar substrate in electrical connection with solder bumps adjacent an edge of the substrate and connection to a lead frame is made by loading the edge of the substrate on a lead frame support with lead frame conductors in engagement with the solder bumps and applying heat to melt the solder.</description><edition>7</edition><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; DEVICES USING STIMULATED EMISSION ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PHYSICS ; SEMICONDUCTOR DEVICES</subject><creationdate>2001</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20010523&amp;DB=EPODOC&amp;CC=EP&amp;NR=1101250A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20010523&amp;DB=EPODOC&amp;CC=EP&amp;NR=1101250A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MAUND, BRIGG</creatorcontrib><title>LEAD FRAME ATTACHMENT FOR OPTOELECTRONIC DEVICE</title><description>An optoelectronic device is mounted on a planar substrate in electrical connection with solder bumps adjacent an edge of the substrate and connection to a lead frame is made by loading the edge of the substrate on a lead frame support with lead frame conductors in engagement with the solder bumps and applying heat to melt the solder.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DEVICES USING STIMULATED EMISSION</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2001</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZND3cXV0UXALcvR1VXAMCXF09vB19QtRcPMPUvAPCPF39XF1Dgny9_N0VnBxDfN0duVhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGuAYaGBoZGpgaOhsZEKAEAq3MlXQ</recordid><startdate>20010523</startdate><enddate>20010523</enddate><creator>MAUND, BRIGG</creator><scope>EVB</scope></search><sort><creationdate>20010523</creationdate><title>LEAD FRAME ATTACHMENT FOR OPTOELECTRONIC DEVICE</title><author>MAUND, BRIGG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP1101250A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2001</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DEVICES USING STIMULATED EMISSION</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>MAUND, BRIGG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MAUND, BRIGG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LEAD FRAME ATTACHMENT FOR OPTOELECTRONIC DEVICE</title><date>2001-05-23</date><risdate>2001</risdate><abstract>An optoelectronic device is mounted on a planar substrate in electrical connection with solder bumps adjacent an edge of the substrate and connection to a lead frame is made by loading the edge of the substrate on a lead frame support with lead frame conductors in engagement with the solder bumps and applying heat to melt the solder.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
SEMICONDUCTOR DEVICES
title LEAD FRAME ATTACHMENT FOR OPTOELECTRONIC DEVICE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-25T02%3A27%3A20IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MAUND,%20BRIGG&rft.date=2001-05-23&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP1101250A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true