Thermocompression assembling device used to connect together a wire with an IC
The conical diamond is retained in material of specific thermal expansion coefficient to ensure that it is not loosened when the temperature rises. The tool comprises a head which includes a small diamond (2) fixed to a support body (3). The diamond has a conical shape with its base retained in the...
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| creator | VAN DER MEER, MATHIJS PIETER |
| description | The conical diamond is retained in material of specific thermal expansion coefficient to ensure that it is not loosened when the temperature rises. The tool comprises a head which includes a small diamond (2) fixed to a support body (3). The diamond has a conical shape with its base retained in the support body, and its tip projecting freely. The diamond is fastened by a system which avoids the diamond becoming unseated as a result of different thermal expansion of the diamond and base material. This may comprise a seating in the block which is also conical in shape, or may comprises a welding material (5) surrounding the base of the cone, within a recess formed in the block. Materials are chosen such that their respective degrees of thermal expansion do not allow the diamond to become loose when the device is heated. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP1099505B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP1099505B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP1099505B13</originalsourceid><addsrcrecordid>eNqNizEOwjAQBN1QIOAP9wGkRChFWqJE0CCK9JFxlsRSfGf5DHyfFDyAZmeK2a259TNSECchJqh6YbKqCI_F80Qj3t6BXoqRspATZri86oS8_sjSxyesk2eyTNdmbzZPuygOP-4MdW3fXI6IMkCjdWDkob2XRV1XRXUuT38kX8YmNf4</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Thermocompression assembling device used to connect together a wire with an IC</title><source>esp@cenet</source><creator>VAN DER MEER, MATHIJS PIETER</creator><creatorcontrib>VAN DER MEER, MATHIJS PIETER</creatorcontrib><description>The conical diamond is retained in material of specific thermal expansion coefficient to ensure that it is not loosened when the temperature rises. The tool comprises a head which includes a small diamond (2) fixed to a support body (3). The diamond has a conical shape with its base retained in the support body, and its tip projecting freely. The diamond is fastened by a system which avoids the diamond becoming unseated as a result of different thermal expansion of the diamond and base material. This may comprise a seating in the block which is also conical in shape, or may comprises a welding material (5) surrounding the base of the cone, within a recess formed in the block. Materials are chosen such that their respective degrees of thermal expansion do not allow the diamond to become loose when the device is heated.</description><edition>7</edition><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2004</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20040901&DB=EPODOC&CC=EP&NR=1099505B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20040901&DB=EPODOC&CC=EP&NR=1099505B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>VAN DER MEER, MATHIJS PIETER</creatorcontrib><title>Thermocompression assembling device used to connect together a wire with an IC</title><description>The conical diamond is retained in material of specific thermal expansion coefficient to ensure that it is not loosened when the temperature rises. The tool comprises a head which includes a small diamond (2) fixed to a support body (3). The diamond has a conical shape with its base retained in the support body, and its tip projecting freely. The diamond is fastened by a system which avoids the diamond becoming unseated as a result of different thermal expansion of the diamond and base material. This may comprise a seating in the block which is also conical in shape, or may comprises a welding material (5) surrounding the base of the cone, within a recess formed in the block. Materials are chosen such that their respective degrees of thermal expansion do not allow the diamond to become loose when the device is heated.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2004</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNizEOwjAQBN1QIOAP9wGkRChFWqJE0CCK9JFxlsRSfGf5DHyfFDyAZmeK2a259TNSECchJqh6YbKqCI_F80Qj3t6BXoqRspATZri86oS8_sjSxyesk2eyTNdmbzZPuygOP-4MdW3fXI6IMkCjdWDkob2XRV1XRXUuT38kX8YmNf4</recordid><startdate>20040901</startdate><enddate>20040901</enddate><creator>VAN DER MEER, MATHIJS PIETER</creator><scope>EVB</scope></search><sort><creationdate>20040901</creationdate><title>Thermocompression assembling device used to connect together a wire with an IC</title><author>VAN DER MEER, MATHIJS PIETER</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP1099505B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2004</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>VAN DER MEER, MATHIJS PIETER</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>VAN DER MEER, MATHIJS PIETER</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Thermocompression assembling device used to connect together a wire with an IC</title><date>2004-09-01</date><risdate>2004</risdate><abstract>The conical diamond is retained in material of specific thermal expansion coefficient to ensure that it is not loosened when the temperature rises. The tool comprises a head which includes a small diamond (2) fixed to a support body (3). The diamond has a conical shape with its base retained in the support body, and its tip projecting freely. The diamond is fastened by a system which avoids the diamond becoming unseated as a result of different thermal expansion of the diamond and base material. This may comprise a seating in the block which is also conical in shape, or may comprises a welding material (5) surrounding the base of the cone, within a recess formed in the block. Materials are chosen such that their respective degrees of thermal expansion do not allow the diamond to become loose when the device is heated.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | Thermocompression assembling device used to connect together a wire with an IC |
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