Thermocompression assembling device used to connect together a wire with an IC
The conical diamond is retained in material of specific thermal expansion coefficient to ensure that it is not loosened when the temperature rises. The tool comprises a head which includes a small diamond (2) fixed to a support body (3). The diamond has a conical shape with its base retained in the...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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