Large non-hermetic multichip module package

A large non-hermetic packaging approach that produces a large multichip module or SuperMCM package (10). The present invention integrates a plurality of multichip module technologies including removable and/or standard high density multilayer interconnect (HDMI) decal substrates (20), and a reworkable chip on board coating (22), housed in a mechanically sound, thermally conductive non-hermetic multichip package. A metal substrate (11) has an HDMI substrate and one or more edge printed wiring boards (13) bonded thereto which are interconnected using wire bonds (18). The HDMI substrate has one or more electronic chips (21) bonded thereto that are connected thereto using wire bonds or other attachment scheme. Components (15, 17) on the one or more edge printed wiring boards are connected to the using edge printed wiring boards wire bonds. The edge printed wiring boards have external attachment pads (14) exposed at their outside edges. A removable cover (25) is disposed over the package except for the external attachment pads at the edges of the package.