Apparatus and method for manufacturing semiconductor device

A loading area (40) capable of forming a sealed space in co-operation with a reaction chamber (22) is provided. In a state in which the inner space of the reaction chamber (22) is separated from the inner space of the loading area (40) by a shutter plate (28), the oxygen concentrations in the reacti...

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Bibliographische Detailangaben
1. Verfasser:	HORIE, YASUHIKO
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	A loading area (40) capable of forming a sealed space in co-operation with a reaction chamber (22) is provided. In a state in which the inner space of the reaction chamber (22) is separated from the inner space of the loading area (40) by a shutter plate (28), the oxygen concentrations in the reaction chamber (22) and the loading area (40) are both adjusted to a specific concentration. After both the oxygen concentrations coincide with each other at the specific value, semiconductor wafers (30) held on a wafer boat (32) are inserted from the loading area (40) into the reaction chamber (22) by a boat lifter (36).