Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles

The polishing pad comprises a first layer and a backing structure (18). The first layer has a polishing surface and a backing surface (19). The first layer is formed of a soluble component in a polymer matrix (16). The polishing pad comprises a first layer and a backing structure (18). The first lay...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	VANGSNESS, JEAN K, BILLINGS, SCOTT C, GILBRIDE, DAVID S, HSU, OSCAR K
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	VANGSNESS, JEAN K BILLINGS, SCOTT C GILBRIDE, DAVID S HSU, OSCAR K
description	The polishing pad comprises a first layer and a backing structure (18). The first layer has a polishing surface and a backing surface (19). The first layer is formed of a soluble component in a polymer matrix (16). The polishing pad comprises a first layer and a backing structure (18). The first layer has a polishing surface and a backing surface (19). The first layer is formed of a soluble component in a polymer matrix (16). The soluble component provides a solid structure in the interior of the first layer, and comprises a material soluble in the slurry to form a void structure in the polishing surface. The backing structure comprises an adhesive layer fixed to the backing surface. The slurry contains abrasive particles and dispersive agent. An independent claim is included for polishing a substrate using the pad.
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP1046466B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP1046466B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP1046466B13</originalsourceid><addsrcrecordid>eNqNy0EKwjAQBdBuXIh6h7mAYLH0AErFZRfuyzROzUA6CZlEcOPZNSKuXf0P__1l9ey9Y7UsNwh4VchKU3bAAsbSzAYdzGQsyqeGH_YTaB41RUykhSdLECIpiaGyIqjLMT7AeEnIUk44RlS-vyHGxMaRrqvFhE5p881VBafucjxvKfiBNKAhoTR0fb1r2qZtD_X-D_ICRwJIpA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles</title><source>esp@cenet</source><creator>VANGSNESS, JEAN K ; BILLINGS, SCOTT C ; GILBRIDE, DAVID S ; HSU, OSCAR K</creator><creatorcontrib>VANGSNESS, JEAN K ; BILLINGS, SCOTT C ; GILBRIDE, DAVID S ; HSU, OSCAR K</creatorcontrib><description>The polishing pad comprises a first layer and a backing structure (18). The first layer has a polishing surface and a backing surface (19). The first layer is formed of a soluble component in a polymer matrix (16). The polishing pad comprises a first layer and a backing structure (18). The first layer has a polishing surface and a backing surface (19). The first layer is formed of a soluble component in a polymer matrix (16). The soluble component provides a solid structure in the interior of the first layer, and comprises a material soluble in the slurry to form a void structure in the polishing surface. The backing structure comprises an adhesive layer fixed to the backing surface. The slurry contains abrasive particles and dispersive agent. An independent claim is included for polishing a substrate using the pad.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TOOLS FOR GRINDING, BUFFING, OR SHARPENING ; TRANSPORTING</subject><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100303&DB=EPODOC&CC=EP&NR=1046466B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100303&DB=EPODOC&CC=EP&NR=1046466B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>VANGSNESS, JEAN K</creatorcontrib><creatorcontrib>BILLINGS, SCOTT C</creatorcontrib><creatorcontrib>GILBRIDE, DAVID S</creatorcontrib><creatorcontrib>HSU, OSCAR K</creatorcontrib><title>Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles</title><description>The polishing pad comprises a first layer and a backing structure (18). The first layer has a polishing surface and a backing surface (19). The first layer is formed of a soluble component in a polymer matrix (16). The polishing pad comprises a first layer and a backing structure (18). The first layer has a polishing surface and a backing surface (19). The first layer is formed of a soluble component in a polymer matrix (16). The soluble component provides a solid structure in the interior of the first layer, and comprises a material soluble in the slurry to form a void structure in the polishing surface. The backing structure comprises an adhesive layer fixed to the backing surface. The slurry contains abrasive particles and dispersive agent. An independent claim is included for polishing a substrate using the pad.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TOOLS FOR GRINDING, BUFFING, OR SHARPENING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2010</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNy0EKwjAQBdBuXIh6h7mAYLH0AErFZRfuyzROzUA6CZlEcOPZNSKuXf0P__1l9ey9Y7UsNwh4VchKU3bAAsbSzAYdzGQsyqeGH_YTaB41RUykhSdLECIpiaGyIqjLMT7AeEnIUk44RlS-vyHGxMaRrqvFhE5p881VBafucjxvKfiBNKAhoTR0fb1r2qZtD_X-D_ICRwJIpA</recordid><startdate>20100303</startdate><enddate>20100303</enddate><creator>VANGSNESS, JEAN K</creator><creator>BILLINGS, SCOTT C</creator><creator>GILBRIDE, DAVID S</creator><creator>HSU, OSCAR K</creator><scope>EVB</scope></search><sort><creationdate>20100303</creationdate><title>Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles</title><author>VANGSNESS, JEAN K ; BILLINGS, SCOTT C ; GILBRIDE, DAVID S ; HSU, OSCAR K</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP1046466B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2010</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TOOLS FOR GRINDING, BUFFING, OR SHARPENING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>VANGSNESS, JEAN K</creatorcontrib><creatorcontrib>BILLINGS, SCOTT C</creatorcontrib><creatorcontrib>GILBRIDE, DAVID S</creatorcontrib><creatorcontrib>HSU, OSCAR K</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>VANGSNESS, JEAN K</au><au>BILLINGS, SCOTT C</au><au>GILBRIDE, DAVID S</au><au>HSU, OSCAR K</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles</title><date>2010-03-03</date><risdate>2010</risdate><abstract>The polishing pad comprises a first layer and a backing structure (18). The first layer has a polishing surface and a backing surface (19). The first layer is formed of a soluble component in a polymer matrix (16). The polishing pad comprises a first layer and a backing structure (18). The first layer has a polishing surface and a backing surface (19). The first layer is formed of a soluble component in a polymer matrix (16). The soluble component provides a solid structure in the interior of the first layer, and comprises a material soluble in the slurry to form a void structure in the polishing surface. The backing structure comprises an adhesive layer fixed to the backing surface. The slurry contains abrasive particles and dispersive agent. An independent claim is included for polishing a substrate using the pad.</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng ; fre ; ger
recordid	cdi_epo_espacenet_EP1046466B1
source	esp@cenet
subjects	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
title	Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-30T10%3A24%3A41IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=VANGSNESS,%20JEAN%20K&rft.date=2010-03-03&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP1046466B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true