Method of photoresist ash residue removal

A method of enabling the removal of fluorine containing residue from a semiconductor substrate comprising applying a gas and/or vapor to which the residue is reactive to the residue while the temperature of the substrate is at an elevated level with respect to ambient temperature and the residue is...

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Hauptverfasser: OWENS, MICHAEL SHAWN, HALLOCK, JOHN SCOTT, ROUNDS, STUART NATHAN, DAHIMENE, MAHMOUD, BERRY, IVAN LOUIS, III
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creator OWENS, MICHAEL SHAWN
HALLOCK, JOHN SCOTT
ROUNDS, STUART NATHAN
DAHIMENE, MAHMOUD
BERRY, IVAN LOUIS, III
description A method of enabling the removal of fluorine containing residue from a semiconductor substrate comprising applying a gas and/or vapor to which the residue is reactive to the residue while the temperature of the substrate is at an elevated level with respect to ambient temperature and the residue is exposed to ultraviolet radiation, for a time period which is sufficient to effect at least one of volatilizing the residue or rendering the residue hydrophilic enough to be removable with deionized water.
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language eng ; fre ; ger
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subjects APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
title Method of photoresist ash residue removal
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