Method of photoresist ash residue removal
A method of enabling the removal of fluorine containing residue from a semiconductor substrate comprising applying a gas and/or vapor to which the residue is reactive to the residue while the temperature of the substrate is at an elevated level with respect to ambient temperature and the residue is...
Gespeichert in:
Hauptverfasser: | , , , , |
---|---|
Format: | Patent |
Sprache: | eng ; fre ; ger |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | OWENS, MICHAEL SHAWN HALLOCK, JOHN SCOTT ROUNDS, STUART NATHAN DAHIMENE, MAHMOUD BERRY, IVAN LOUIS, III |
description | A method of enabling the removal of fluorine containing residue from a semiconductor substrate comprising applying a gas and/or vapor to which the residue is reactive to the residue while the temperature of the substrate is at an elevated level with respect to ambient temperature and the residue is exposed to ultraviolet radiation, for a time period which is sufficient to effect at least one of volatilizing the residue or rendering the residue hydrophilic enough to be removable with deionized water. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP1032026B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP1032026B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP1032026B13</originalsourceid><addsrcrecordid>eNrjZND0TS3JyE9RyE9TKMjIL8kvSi3OLC5RSCzOUAAxU0pTgXRuflliDg8Da1piTnEqL5TmZlBwcw1x9tBNLciPTy0uSExOzUstiXcNMDQwNjIwMnMyNCZCCQC8yyhT</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method of photoresist ash residue removal</title><source>esp@cenet</source><creator>OWENS, MICHAEL SHAWN ; HALLOCK, JOHN SCOTT ; ROUNDS, STUART NATHAN ; DAHIMENE, MAHMOUD ; BERRY, IVAN LOUIS, III</creator><creatorcontrib>OWENS, MICHAEL SHAWN ; HALLOCK, JOHN SCOTT ; ROUNDS, STUART NATHAN ; DAHIMENE, MAHMOUD ; BERRY, IVAN LOUIS, III</creatorcontrib><description>A method of enabling the removal of fluorine containing residue from a semiconductor substrate comprising applying a gas and/or vapor to which the residue is reactive to the residue while the temperature of the substrate is at an elevated level with respect to ambient temperature and the residue is exposed to ultraviolet radiation, for a time period which is sufficient to effect at least one of volatilizing the residue or rendering the residue hydrophilic enough to be removable with deionized water.</description><language>eng ; fre ; ger</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; BASIC ELECTRIC ELEMENTS ; CINEMATOGRAPHY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; SEMICONDUCTOR DEVICES</subject><creationdate>2008</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080917&DB=EPODOC&CC=EP&NR=1032026B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080917&DB=EPODOC&CC=EP&NR=1032026B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OWENS, MICHAEL SHAWN</creatorcontrib><creatorcontrib>HALLOCK, JOHN SCOTT</creatorcontrib><creatorcontrib>ROUNDS, STUART NATHAN</creatorcontrib><creatorcontrib>DAHIMENE, MAHMOUD</creatorcontrib><creatorcontrib>BERRY, IVAN LOUIS, III</creatorcontrib><title>Method of photoresist ash residue removal</title><description>A method of enabling the removal of fluorine containing residue from a semiconductor substrate comprising applying a gas and/or vapor to which the residue is reactive to the residue while the temperature of the substrate is at an elevated level with respect to ambient temperature and the residue is exposed to ultraviolet radiation, for a time period which is sufficient to effect at least one of volatilizing the residue or rendering the residue hydrophilic enough to be removable with deionized water.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2008</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZND0TS3JyE9RyE9TKMjIL8kvSi3OLC5RSCzOUAAxU0pTgXRuflliDg8Da1piTnEqL5TmZlBwcw1x9tBNLciPTy0uSExOzUstiXcNMDQwNjIwMnMyNCZCCQC8yyhT</recordid><startdate>20080917</startdate><enddate>20080917</enddate><creator>OWENS, MICHAEL SHAWN</creator><creator>HALLOCK, JOHN SCOTT</creator><creator>ROUNDS, STUART NATHAN</creator><creator>DAHIMENE, MAHMOUD</creator><creator>BERRY, IVAN LOUIS, III</creator><scope>EVB</scope></search><sort><creationdate>20080917</creationdate><title>Method of photoresist ash residue removal</title><author>OWENS, MICHAEL SHAWN ; HALLOCK, JOHN SCOTT ; ROUNDS, STUART NATHAN ; DAHIMENE, MAHMOUD ; BERRY, IVAN LOUIS, III</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP1032026B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2008</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>OWENS, MICHAEL SHAWN</creatorcontrib><creatorcontrib>HALLOCK, JOHN SCOTT</creatorcontrib><creatorcontrib>ROUNDS, STUART NATHAN</creatorcontrib><creatorcontrib>DAHIMENE, MAHMOUD</creatorcontrib><creatorcontrib>BERRY, IVAN LOUIS, III</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OWENS, MICHAEL SHAWN</au><au>HALLOCK, JOHN SCOTT</au><au>ROUNDS, STUART NATHAN</au><au>DAHIMENE, MAHMOUD</au><au>BERRY, IVAN LOUIS, III</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method of photoresist ash residue removal</title><date>2008-09-17</date><risdate>2008</risdate><abstract>A method of enabling the removal of fluorine containing residue from a semiconductor substrate comprising applying a gas and/or vapor to which the residue is reactive to the residue while the temperature of the substrate is at an elevated level with respect to ambient temperature and the residue is exposed to ultraviolet radiation, for a time period which is sufficient to effect at least one of volatilizing the residue or rendering the residue hydrophilic enough to be removable with deionized water.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng ; fre ; ger |
recordid | cdi_epo_espacenet_EP1032026B1 |
source | esp@cenet |
subjects | APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES |
title | Method of photoresist ash residue removal |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-09T02%3A02%3A40IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=OWENS,%20MICHAEL%20SHAWN&rft.date=2008-09-17&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP1032026B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |