NON-BAKING HOT-MELT ADHESIVE PREPARATION

The invention relates to a hot-melt adhesive preparation, containing 25 to 99.5 wt. % of a thermoplastic polymer with a melting range between 40C and 250C, 0 to 40 wt. % of a resin for reinforcing the adhesive force of the preparation, 0 to 40 wt. % of a wax for regulating the viscosity of the prepa...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BEHLER, ANSGAR, HERLFTERKAMP, BERNHARD
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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