METHOD FOR CONNECTING SURFACE MOUNT COMPONENTS TO A SUBSTRATE
There is disclosed herein a method and apparatus for connecting surface mount components to a substrate, comprising the steps of: (1) providing an electronic assembly which includes solder paste depositions atop mounting pads on a substrate and at least one electronic component having terminations a...
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| creator | PARIKH, MAYANK BAKER, JAY, DEAVIS LEMECHA, MYRON SINKUNAS, PETER, JOSEPH QUILTY, WILLIAM, F., JR MCLESKEY, EDWARD, P GLOVATSKY, ANDREW, Z |
| description | There is disclosed herein a method and apparatus for connecting surface mount components to a substrate, comprising the steps of: (1) providing an electronic assembly which includes solder paste depositions atop mounting pads on a substrate and at least one electronic component having terminations arranged such that each termination rests atop a respective mounting pad; (2) preheating the assembly from a first temperature T1 to a second temperature T2 below the melting point TM of the solder paste; (3) soaking the assembly at substantially the second temperature T2; (4) selectively heating each solder paste deposition to a third temperature T3 above the melting point of the solder paste depositions while maintaining the substrate at substantially the second temperature T2; and (5) cooling the assembly to a fourth temperature T4 below the second temperature T2. |
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MCLESKEY, EDWARD, P ; GLOVATSKY, ANDREW, Z</creatorcontrib><description>There is disclosed herein a method and apparatus for connecting surface mount components to a substrate, comprising the steps of: (1) providing an electronic assembly which includes solder paste depositions atop mounting pads on a substrate and at least one electronic component having terminations arranged such that each termination rests atop a respective mounting pad; (2) preheating the assembly from a first temperature T1 to a second temperature T2 below the melting point TM of the solder paste; (3) soaking the assembly at substantially the second temperature T2; (4) selectively heating each solder paste deposition to a third temperature T3 above the melting point of the solder paste depositions while maintaining the substrate at substantially the second temperature T2; and (5) cooling the assembly to a fourth temperature T4 below the second temperature T2.</description><edition>7</edition><language>eng ; fre ; ger</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020102&DB=EPODOC&CC=EP&NR=1023821B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020102&DB=EPODOC&CC=EP&NR=1023821B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>PARIKH, MAYANK</creatorcontrib><creatorcontrib>BAKER, JAY, DEAVIS</creatorcontrib><creatorcontrib>LEMECHA, MYRON</creatorcontrib><creatorcontrib>SINKUNAS, PETER, JOSEPH</creatorcontrib><creatorcontrib>QUILTY, WILLIAM, F., JR</creatorcontrib><creatorcontrib>MCLESKEY, EDWARD, P</creatorcontrib><creatorcontrib>GLOVATSKY, ANDREW, Z</creatorcontrib><title>METHOD FOR CONNECTING SURFACE MOUNT COMPONENTS TO A SUBSTRATE</title><description>There is disclosed herein a method and apparatus for connecting surface mount components to a substrate, comprising the steps of: (1) providing an electronic assembly which includes solder paste depositions atop mounting pads on a substrate and at least one electronic component having terminations arranged such that each termination rests atop a respective mounting pad; (2) preheating the assembly from a first temperature T1 to a second temperature T2 below the melting point TM of the solder paste; (3) soaking the assembly at substantially the second temperature T2; (4) selectively heating each solder paste deposition to a third temperature T3 above the melting point of the solder paste depositions while maintaining the substrate at substantially the second temperature T2; and (5) cooling the assembly to a fourth temperature T4 below the second temperature T2.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLD1dQ3x8HdRcPMPUnD29_NzdQ7x9HNXCA4NcnN0dlXw9Q_1CwFK-Ab4-7n6hQQrhPgrOAJlnYJDghxDXHkYWNMSc4pTeaE0N4OCm2uIs4duakF-fGpxQWJyal5qSbxrgKGBkbGFkaGToTERSgDrEimD</recordid><startdate>20020102</startdate><enddate>20020102</enddate><creator>PARIKH, MAYANK</creator><creator>BAKER, JAY, DEAVIS</creator><creator>LEMECHA, MYRON</creator><creator>SINKUNAS, PETER, JOSEPH</creator><creator>QUILTY, WILLIAM, F., JR</creator><creator>MCLESKEY, EDWARD, P</creator><creator>GLOVATSKY, ANDREW, Z</creator><scope>EVB</scope></search><sort><creationdate>20020102</creationdate><title>METHOD FOR CONNECTING SURFACE MOUNT COMPONENTS TO A SUBSTRATE</title><author>PARIKH, MAYANK ; 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(2) preheating the assembly from a first temperature T1 to a second temperature T2 below the melting point TM of the solder paste; (3) soaking the assembly at substantially the second temperature T2; (4) selectively heating each solder paste deposition to a third temperature T3 above the melting point of the solder paste depositions while maintaining the substrate at substantially the second temperature T2; and (5) cooling the assembly to a fourth temperature T4 below the second temperature T2.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | METHOD FOR CONNECTING SURFACE MOUNT COMPONENTS TO A SUBSTRATE |
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