Solder resist window configurations for solder paste overprinting

There is disclosed herein an electronic circuit assembly, such as a printed circuit board (20), having solder resist windows (30) with one or more enlarged solder resist pullback zones (70), thereby facilitating solder paste overprinting (44).

Bibliographische Detailangaben

Hauptverfasser:	MCMILLAN, RICHARD KEITH, JAIRAZBHOY, VIVEK AMIR
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!