Electron-beam excited plasma generator
The present invention provides an electron-beam excited plasma generator which can effectively form samples of larger areas. The electron-beam excited plasma generator according to the present invention comprises a cathode (11) for emitting thermions; a discharge electrode (23) for gas discharge bet...
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| creator | MORI, YUKITAKA RYOJI, MAKOTO BAN, MASAHITO HASEGAWA, TAKESHI TOKAI, MASAKUNI |
| description | The present invention provides an electron-beam excited plasma generator which can effectively form samples of larger areas. The electron-beam excited plasma generator according to the present invention comprises a cathode (11) for emitting thermions; a discharge electrode (23) for gas discharge between the cathode and the same; an intermediate electrode (13) positioned coaxially with the discharge electrode in an axial direction; a discharge chamber (2) to be filled with discharge gas plasma generated by the gas discharge between the cathode and the discharge electrode; a plasma processing chamber (3) formed adjacent to the discharge chamber with a partition wall (21) disposed therebetween and positioned so that a surface-to-be-processed of a workpiece-to-be-processed (35) is positioned perpendicular to the axial direction; a plurality of orifices (22) for pulling out electrons in the discharge gas plasma in the discharge chamber into the plasma processing chamber, each being formed in the partition wall substantially perpendicular to the axial line and distributed radially with respect to the axial direction; and an accleerating electrode (31) disposed in the plasma processing chamber for pulling out and accelerating the electrons through the orifices. |
| format | Patent |
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The electron-beam excited plasma generator according to the present invention comprises a cathode (11) for emitting thermions; a discharge electrode (23) for gas discharge between the cathode and the same; an intermediate electrode (13) positioned coaxially with the discharge electrode in an axial direction; a discharge chamber (2) to be filled with discharge gas plasma generated by the gas discharge between the cathode and the discharge electrode; a plasma processing chamber (3) formed adjacent to the discharge chamber with a partition wall (21) disposed therebetween and positioned so that a surface-to-be-processed of a workpiece-to-be-processed (35) is positioned perpendicular to the axial direction; a plurality of orifices (22) for pulling out electrons in the discharge gas plasma in the discharge chamber into the plasma processing chamber, each being formed in the partition wall substantially perpendicular to the axial line and distributed radially with respect to the axial direction; and an accleerating electrode (31) disposed in the plasma processing chamber for pulling out and accelerating the electrons through the orifices.</description><edition>7</edition><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 ; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE ; PLASMA TECHNIQUE ; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS ; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2000</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20001011&DB=EPODOC&CC=EP&NR=0884760A3$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20001011&DB=EPODOC&CC=EP&NR=0884760A3$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MORI, YUKITAKA</creatorcontrib><creatorcontrib>RYOJI, MAKOTO</creatorcontrib><creatorcontrib>BAN, MASAHITO</creatorcontrib><creatorcontrib>HASEGAWA, TAKESHI</creatorcontrib><creatorcontrib>TOKAI, MASAKUNI</creatorcontrib><title>Electron-beam excited plasma generator</title><description>The present invention provides an electron-beam excited plasma generator which can effectively form samples of larger areas. The electron-beam excited plasma generator according to the present invention comprises a cathode (11) for emitting thermions; a discharge electrode (23) for gas discharge between the cathode and the same; an intermediate electrode (13) positioned coaxially with the discharge electrode in an axial direction; a discharge chamber (2) to be filled with discharge gas plasma generated by the gas discharge between the cathode and the discharge electrode; a plasma processing chamber (3) formed adjacent to the discharge chamber with a partition wall (21) disposed therebetween and positioned so that a surface-to-be-processed of a workpiece-to-be-processed (35) is positioned perpendicular to the axial direction; a plurality of orifices (22) for pulling out electrons in the discharge gas plasma in the discharge chamber into the plasma processing chamber, each being formed in the partition wall substantially perpendicular to the axial line and distributed radially with respect to the axial direction; and an accleerating electrode (31) disposed in the plasma processing chamber for pulling out and accelerating the electrons through the orifices.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</subject><subject>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</subject><subject>PLASMA TECHNIQUE</subject><subject>PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS</subject><subject>PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2000</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFBzzUlNLinKz9NNSk3MVUitSM4sSU1RKMhJLM5NVEhPzUstSizJL-JhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJQJUl8a4BBhYWJuZmBo7GxkQoAQAoPidE</recordid><startdate>20001011</startdate><enddate>20001011</enddate><creator>MORI, YUKITAKA</creator><creator>RYOJI, MAKOTO</creator><creator>BAN, MASAHITO</creator><creator>HASEGAWA, TAKESHI</creator><creator>TOKAI, MASAKUNI</creator><scope>EVB</scope></search><sort><creationdate>20001011</creationdate><title>Electron-beam excited plasma generator</title><author>MORI, YUKITAKA ; RYOJI, MAKOTO ; BAN, MASAHITO ; HASEGAWA, TAKESHI ; TOKAI, MASAKUNI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP0884760A33</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2000</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</topic><topic>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</topic><topic>PLASMA TECHNIQUE</topic><topic>PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS</topic><topic>PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>MORI, YUKITAKA</creatorcontrib><creatorcontrib>RYOJI, MAKOTO</creatorcontrib><creatorcontrib>BAN, MASAHITO</creatorcontrib><creatorcontrib>HASEGAWA, TAKESHI</creatorcontrib><creatorcontrib>TOKAI, MASAKUNI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MORI, YUKITAKA</au><au>RYOJI, MAKOTO</au><au>BAN, MASAHITO</au><au>HASEGAWA, TAKESHI</au><au>TOKAI, MASAKUNI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electron-beam excited plasma generator</title><date>2000-10-11</date><risdate>2000</risdate><abstract>The present invention provides an electron-beam excited plasma generator which can effectively form samples of larger areas. The electron-beam excited plasma generator according to the present invention comprises a cathode (11) for emitting thermions; a discharge electrode (23) for gas discharge between the cathode and the same; an intermediate electrode (13) positioned coaxially with the discharge electrode in an axial direction; a discharge chamber (2) to be filled with discharge gas plasma generated by the gas discharge between the cathode and the discharge electrode; a plasma processing chamber (3) formed adjacent to the discharge chamber with a partition wall (21) disposed therebetween and positioned so that a surface-to-be-processed of a workpiece-to-be-processed (35) is positioned perpendicular to the axial direction; a plurality of orifices (22) for pulling out electrons in the discharge gas plasma in the discharge chamber into the plasma processing chamber, each being formed in the partition wall substantially perpendicular to the axial line and distributed radially with respect to the axial direction; and an accleerating electrode (31) disposed in the plasma processing chamber for pulling out and accelerating the electrons through the orifices.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PLASMA TECHNIQUE PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | Electron-beam excited plasma generator |
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