GLASS BONDING LAYER FOR A CERAMIC CIRCUIT BOARD SUPPORT SUBSTRATE

In the manufacture of ceramic circuit boards having ceramic or metal support substrates, a bonding glass layer that is adherent both to the substrate material and to multilayer green tape compositions having circuitry printed thereon, is deposited and flowed onto the support substrate. The bonding g...

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Hauptverfasser: PRABHU, ASHOK, NARAYAN, THALER, BARRY, JAY
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THALER, BARRY, JAY
description In the manufacture of ceramic circuit boards having ceramic or metal support substrates, a bonding glass layer that is adherent both to the substrate material and to multilayer green tape compositions having circuitry printed thereon, is deposited and flowed onto the support substrate. The bonding glasses suitable for use with nickel plated metal substrates and green tape compositions containing forsterite-cordierite-type glasses are mixed oxides including calcium, zinc and boron as well as other oxides. These bonding glasses have a thermal coefficient of expansion that is larger than said metal substrate, and a flow temperature below that of said cordierite-type glasses.
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The bonding glasses suitable for use with nickel plated metal substrates and green tape compositions containing forsterite-cordierite-type glasses are mixed oxides including calcium, zinc and boron as well as other oxides. 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language eng ; fre ; ger
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subjects BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
title GLASS BONDING LAYER FOR A CERAMIC CIRCUIT BOARD SUPPORT SUBSTRATE
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