Method of making In-containing III/V semiconductor devices

A semiconductor device comprising In-contg. III-V material is mfd. by: (a) placing a body of the In-contg. III-V material in a reactor chamber; and (b) flowing a gas mixt. of N2 and BCl3 into the chamber and applying microwave power to the gas to form a plasma to remove some of the semiconductor mat...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: REN, FAN, HOBSON, WILLIAM SCOTT, LOPATA, JOHN
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator REN, FAN
HOBSON, WILLIAM SCOTT
LOPATA, JOHN
description A semiconductor device comprising In-contg. III-V material is mfd. by: (a) placing a body of the In-contg. III-V material in a reactor chamber; and (b) flowing a gas mixt. of N2 and BCl3 into the chamber and applying microwave power to the gas to form a plasma to remove some of the semiconductor material. The N2/BCl3 ratio is such that the etch rate of the material is at least 50% larger than the etch rate when the ratio is zero, all else being equal.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP0755069A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP0755069A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP0755069A13</originalsourceid><addsrcrecordid>eNrjZLDyTS3JyE9RyE9TyE3MzsxLV_DM003OzytJzMwD8zw99cMUilNzM4GCKaXJJflFCimpZZnJqcU8DKxpiTnFqbxQmptBwc01xNlDN7UgPz61uCAxOTUvtSTeNcDA3NTUwMzS0dCYCCUAxiYuBg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method of making In-containing III/V semiconductor devices</title><source>esp@cenet</source><creator>REN, FAN ; HOBSON, WILLIAM SCOTT ; LOPATA, JOHN</creator><creatorcontrib>REN, FAN ; HOBSON, WILLIAM SCOTT ; LOPATA, JOHN</creatorcontrib><description>A semiconductor device comprising In-contg. III-V material is mfd. by: (a) placing a body of the In-contg. III-V material in a reactor chamber; and (b) flowing a gas mixt. of N2 and BCl3 into the chamber and applying microwave power to the gas to form a plasma to remove some of the semiconductor material. The N2/BCl3 ratio is such that the etch rate of the material is at least 50% larger than the etch rate when the ratio is zero, all else being equal.</description><edition>6</edition><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; DEVICES USING STIMULATED EMISSION ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>1997</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19970122&amp;DB=EPODOC&amp;CC=EP&amp;NR=0755069A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19970122&amp;DB=EPODOC&amp;CC=EP&amp;NR=0755069A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>REN, FAN</creatorcontrib><creatorcontrib>HOBSON, WILLIAM SCOTT</creatorcontrib><creatorcontrib>LOPATA, JOHN</creatorcontrib><title>Method of making In-containing III/V semiconductor devices</title><description>A semiconductor device comprising In-contg. III-V material is mfd. by: (a) placing a body of the In-contg. III-V material in a reactor chamber; and (b) flowing a gas mixt. of N2 and BCl3 into the chamber and applying microwave power to the gas to form a plasma to remove some of the semiconductor material. The N2/BCl3 ratio is such that the etch rate of the material is at least 50% larger than the etch rate when the ratio is zero, all else being equal.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DEVICES USING STIMULATED EMISSION</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1997</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLDyTS3JyE9RyE9TyE3MzsxLV_DM003OzytJzMwD8zw99cMUilNzM4GCKaXJJflFCimpZZnJqcU8DKxpiTnFqbxQmptBwc01xNlDN7UgPz61uCAxOTUvtSTeNcDA3NTUwMzS0dCYCCUAxiYuBg</recordid><startdate>19970122</startdate><enddate>19970122</enddate><creator>REN, FAN</creator><creator>HOBSON, WILLIAM SCOTT</creator><creator>LOPATA, JOHN</creator><scope>EVB</scope></search><sort><creationdate>19970122</creationdate><title>Method of making In-containing III/V semiconductor devices</title><author>REN, FAN ; HOBSON, WILLIAM SCOTT ; LOPATA, JOHN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP0755069A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>1997</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DEVICES USING STIMULATED EMISSION</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>REN, FAN</creatorcontrib><creatorcontrib>HOBSON, WILLIAM SCOTT</creatorcontrib><creatorcontrib>LOPATA, JOHN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>REN, FAN</au><au>HOBSON, WILLIAM SCOTT</au><au>LOPATA, JOHN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method of making In-containing III/V semiconductor devices</title><date>1997-01-22</date><risdate>1997</risdate><abstract>A semiconductor device comprising In-contg. III-V material is mfd. by: (a) placing a body of the In-contg. III-V material in a reactor chamber; and (b) flowing a gas mixt. of N2 and BCl3 into the chamber and applying microwave power to the gas to form a plasma to remove some of the semiconductor material. The N2/BCl3 ratio is such that the etch rate of the material is at least 50% larger than the etch rate when the ratio is zero, all else being equal.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng ; fre ; ger
recordid cdi_epo_espacenet_EP0755069A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Method of making In-containing III/V semiconductor devices
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-23T04%3A52%3A41IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=REN,%20FAN&rft.date=1997-01-22&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP0755069A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true