Method of making In-containing III/V semiconductor devices
A semiconductor device comprising In-contg. III-V material is mfd. by: (a) placing a body of the In-contg. III-V material in a reactor chamber; and (b) flowing a gas mixt. of N2 and BCl3 into the chamber and applying microwave power to the gas to form a plasma to remove some of the semiconductor mat...
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creator | REN, FAN HOBSON, WILLIAM SCOTT LOPATA, JOHN |
description | A semiconductor device comprising In-contg. III-V material is mfd. by: (a) placing a body of the In-contg. III-V material in a reactor chamber; and (b) flowing a gas mixt. of N2 and BCl3 into the chamber and applying microwave power to the gas to form a plasma to remove some of the semiconductor material. The N2/BCl3 ratio is such that the etch rate of the material is at least 50% larger than the etch rate when the ratio is zero, all else being equal. |
format | Patent |
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III-V material in a reactor chamber; and (b) flowing a gas mixt. of N2 and BCl3 into the chamber and applying microwave power to the gas to form a plasma to remove some of the semiconductor material. The N2/BCl3 ratio is such that the etch rate of the material is at least 50% larger than the etch rate when the ratio is zero, all else being equal.</description><edition>6</edition><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; DEVICES USING STIMULATED EMISSION ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>1997</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19970122&DB=EPODOC&CC=EP&NR=0755069A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19970122&DB=EPODOC&CC=EP&NR=0755069A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>REN, FAN</creatorcontrib><creatorcontrib>HOBSON, WILLIAM SCOTT</creatorcontrib><creatorcontrib>LOPATA, JOHN</creatorcontrib><title>Method of making In-containing III/V semiconductor devices</title><description>A semiconductor device comprising In-contg. III-V material is mfd. by: (a) placing a body of the In-contg. III-V material in a reactor chamber; and (b) flowing a gas mixt. of N2 and BCl3 into the chamber and applying microwave power to the gas to form a plasma to remove some of the semiconductor material. The N2/BCl3 ratio is such that the etch rate of the material is at least 50% larger than the etch rate when the ratio is zero, all else being equal.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DEVICES USING STIMULATED EMISSION</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1997</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLDyTS3JyE9RyE9TyE3MzsxLV_DM003OzytJzMwD8zw99cMUilNzM4GCKaXJJflFCimpZZnJqcU8DKxpiTnFqbxQmptBwc01xNlDN7UgPz61uCAxOTUvtSTeNcDA3NTUwMzS0dCYCCUAxiYuBg</recordid><startdate>19970122</startdate><enddate>19970122</enddate><creator>REN, FAN</creator><creator>HOBSON, WILLIAM SCOTT</creator><creator>LOPATA, JOHN</creator><scope>EVB</scope></search><sort><creationdate>19970122</creationdate><title>Method of making In-containing III/V semiconductor devices</title><author>REN, FAN ; HOBSON, WILLIAM SCOTT ; LOPATA, JOHN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP0755069A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>1997</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DEVICES USING STIMULATED EMISSION</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>REN, FAN</creatorcontrib><creatorcontrib>HOBSON, WILLIAM SCOTT</creatorcontrib><creatorcontrib>LOPATA, JOHN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>REN, FAN</au><au>HOBSON, WILLIAM SCOTT</au><au>LOPATA, JOHN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method of making In-containing III/V semiconductor devices</title><date>1997-01-22</date><risdate>1997</risdate><abstract>A semiconductor device comprising In-contg. III-V material is mfd. by: (a) placing a body of the In-contg. III-V material in a reactor chamber; and (b) flowing a gas mixt. of N2 and BCl3 into the chamber and applying microwave power to the gas to form a plasma to remove some of the semiconductor material. The N2/BCl3 ratio is such that the etch rate of the material is at least 50% larger than the etch rate when the ratio is zero, all else being equal.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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language | eng ; fre ; ger |
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subjects | BASIC ELECTRIC ELEMENTS DEVICES USING STIMULATED EMISSION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Method of making In-containing III/V semiconductor devices |
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