Bonding wire with integral connection

A wire for use in making connection to bond pads of semiconductor devices and the like, the interconnection and method of making the interconnection between a semiconductor device or the like and an external connection point with a plated (3) wire (1) which can have one or more different layers of p...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	VINSON, MICHAEL R
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM LINE CONNECTORS PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING
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