Capillary and method of bonding
A capillary tube (1) for bonding wire (5) having a bore (3) and a cross section in a direction normal to the bore having a long dimension and a short dimension in a direction normal to the long dimension. The bond is made to bond pads (9) using the capillary tube by bonding a wire to one bond pad wh...
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| creator | VINSON, MICHAEL R KUCKHAHN, ALBERT H TEST, HOWARD R |
| description | A capillary tube (1) for bonding wire (5) having a bore (3) and a cross section in a direction normal to the bore having a long dimension and a short dimension in a direction normal to the long dimension. The bond is made to bond pads (9) using the capillary tube by bonding a wire to one bond pad while the capillary is oriented with the long dimension (25 to 27 or 35 to 37) in a first direction and bonding a wire to a die immediately adjacent the one bond pad with the capillary which can be oriented with the long dimension in the same direction or in a direction normal to the first direction, as may be required. |
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The bond is made to bond pads (9) using the capillary tube by bonding a wire to one bond pad while the capillary is oriented with the long dimension (25 to 27 or 35 to 37) in a first direction and bonding a wire to a die immediately adjacent the one bond pad with the capillary which can be oriented with the long dimension in the same direction or in a direction normal to the first direction, as may be required.</description><edition>6</edition><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>1995</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19951213&DB=EPODOC&CC=EP&NR=0686454A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19951213&DB=EPODOC&CC=EP&NR=0686454A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>VINSON, MICHAEL R</creatorcontrib><creatorcontrib>KUCKHAHN, ALBERT H</creatorcontrib><creatorcontrib>TEST, HOWARD R</creatorcontrib><title>Capillary and method of bonding</title><description>A capillary tube (1) for bonding wire (5) having a bore (3) and a cross section in a direction normal to the bore having a long dimension and a short dimension in a direction normal to the long dimension. 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The bond is made to bond pads (9) using the capillary tube by bonding a wire to one bond pad while the capillary is oriented with the long dimension (25 to 27 or 35 to 37) in a first direction and bonding a wire to a die immediately adjacent the one bond pad with the capillary which can be oriented with the long dimension in the same direction or in a direction normal to the first direction, as may be required.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | Capillary and method of bonding |
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