METHOD FOR THE ENCAPSULATION OF COMPONENTS OR ELECTRONIC UNITS AND DEVICES ENCAPSULATED USING SAID METHOD

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Hauptverfasser:	MOREAU, EMMANUEL, MANGERET, RENAUD, DESSAUX, CHRISTOPHE, LACABANNE, COLETTE, FERRANDIZ, JEAN-MARIE, FARENC, JEAN, SEGUI, YVAN
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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creator	MOREAU, EMMANUEL MANGERET, RENAUD DESSAUX, CHRISTOPHE LACABANNE, COLETTE FERRANDIZ, JEAN-MARIE FARENC, JEAN SEGUI, YVAN
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language	eng ; fre ; ger
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subjects	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
title	METHOD FOR THE ENCAPSULATION OF COMPONENTS OR ELECTRONIC UNITS AND DEVICES ENCAPSULATED USING SAID METHOD
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