Method for mounting electronic component on a flexible printed circuit board

The invention concerns a method for mounting electronic components and a related flexible printed circuit board. This board is constituted with a first insulation film (1) covering a first insulating resist layer (3), a second insulation film (7) covering a second insulating resist layer (6) and a p...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NISHIOKA, NAOHIRO, TANABE, KOUJI
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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