TRAY FOR INTEGRATED CIRCUITS

A tray for integrated circuits which is made from a thermoplastic resin composition comprising 100 parts by weight of a polyphenylene ether resin, 0.1 to 40 parts by weight of carbon fibers having a number-average fiber length in the range of 0.05 to 1.5 mm, and 0.1 to 50 parts by weight of a flaky...

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Bibliographische Detailangaben
Hauptverfasser:	YOSHIMURA, MASAJI, KANEZAKI, KAZUHARU, TAKIGUCHI, MINORU, UEKI, TORU, IWATA, INEO
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING HANDLING THIN OR FILAMENTARY MATERIAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES STORING THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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