TRAY FOR INTEGRATED CIRCUITS
A tray for integrated circuits which is made from a thermoplastic resin composition comprising 100 parts by weight of a polyphenylene ether resin, 0.1 to 40 parts by weight of carbon fibers having a number-average fiber length in the range of 0.05 to 1.5 mm, and 0.1 to 50 parts by weight of a flaky...
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| creator | YOSHIMURA, MASAJI KANEZAKI, KAZUHARU TAKIGUCHI, MINORU UEKI, TORU IWATA, INEO |
| description | A tray for integrated circuits which is made from a thermoplastic resin composition comprising 100 parts by weight of a polyphenylene ether resin, 0.1 to 40 parts by weight of carbon fibers having a number-average fiber length in the range of 0.05 to 1.5 mm, and 0.1 to 50 parts by weight of a flaky inorganic filler having an aspect ratio of 20 or above, and which has a surface resistivity in the range of 10 to 10 OMEGA . This tray is excellent in conductivity and heat resistance and reduced in warpage. |
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This tray is excellent in conductivity and heat resistance and reduced in warpage.</description><edition>6</edition><language>eng ; fre ; ger</language><subject>ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR ; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS ; CONVEYING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL PROCESSES OF COMPOUNDING ; HANDLING THIN OR FILAMENTARY MATERIAL ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PACKAGES ; PACKAGING ELEMENTS ; PACKING ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; STORING ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; WORKING-UP</subject><creationdate>1998</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19980128&DB=EPODOC&CC=EP&NR=0564660B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19980128&DB=EPODOC&CC=EP&NR=0564660B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YOSHIMURA, MASAJI</creatorcontrib><creatorcontrib>KANEZAKI, KAZUHARU</creatorcontrib><creatorcontrib>TAKIGUCHI, MINORU</creatorcontrib><creatorcontrib>UEKI, TORU</creatorcontrib><creatorcontrib>IWATA, INEO</creatorcontrib><title>TRAY FOR INTEGRATED CIRCUITS</title><description>A tray for integrated circuits which is made from a thermoplastic resin composition comprising 100 parts by weight of a polyphenylene ether resin, 0.1 to 40 parts by weight of carbon fibers having a number-average fiber length in the range of 0.05 to 1.5 mm, and 0.1 to 50 parts by weight of a flaky inorganic filler having an aspect ratio of 20 or above, and which has a surface resistivity in the range of 10 to 10 OMEGA . This tray is excellent in conductivity and heat resistance and reduced in warpage.</description><subject>ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR</subject><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS</subject><subject>CONVEYING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>HANDLING THIN OR FILAMENTARY MATERIAL</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PACKAGES</subject><subject>PACKAGING ELEMENTS</subject><subject>PACKING</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>STORING</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1998</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAJCXKMVHDzD1Lw9AtxdQ9yDHF1UXD2DHIO9QwJ5mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BBqZmJmZmBk6GxkQoAQA4gCB3</recordid><startdate>19980128</startdate><enddate>19980128</enddate><creator>YOSHIMURA, MASAJI</creator><creator>KANEZAKI, KAZUHARU</creator><creator>TAKIGUCHI, MINORU</creator><creator>UEKI, TORU</creator><creator>IWATA, INEO</creator><scope>EVB</scope></search><sort><creationdate>19980128</creationdate><title>TRAY FOR INTEGRATED CIRCUITS</title><author>YOSHIMURA, MASAJI ; KANEZAKI, KAZUHARU ; TAKIGUCHI, MINORU ; UEKI, TORU ; IWATA, INEO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP0564660B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>1998</creationdate><topic>ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR</topic><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS</topic><topic>CONVEYING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>HANDLING THIN OR FILAMENTARY MATERIAL</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PACKAGES</topic><topic>PACKAGING ELEMENTS</topic><topic>PACKING</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>STORING</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>YOSHIMURA, MASAJI</creatorcontrib><creatorcontrib>KANEZAKI, KAZUHARU</creatorcontrib><creatorcontrib>TAKIGUCHI, MINORU</creatorcontrib><creatorcontrib>UEKI, TORU</creatorcontrib><creatorcontrib>IWATA, INEO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YOSHIMURA, MASAJI</au><au>KANEZAKI, KAZUHARU</au><au>TAKIGUCHI, MINORU</au><au>UEKI, TORU</au><au>IWATA, INEO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TRAY FOR INTEGRATED CIRCUITS</title><date>1998-01-28</date><risdate>1998</risdate><abstract>A tray for integrated circuits which is made from a thermoplastic resin composition comprising 100 parts by weight of a polyphenylene ether resin, 0.1 to 40 parts by weight of carbon fibers having a number-average fiber length in the range of 0.05 to 1.5 mm, and 0.1 to 50 parts by weight of a flaky inorganic filler having an aspect ratio of 20 or above, and which has a surface resistivity in the range of 10 to 10 OMEGA . This tray is excellent in conductivity and heat resistance and reduced in warpage.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING HANDLING THIN OR FILAMENTARY MATERIAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES STORING THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP |
| title | TRAY FOR INTEGRATED CIRCUITS |
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