Multichip module substrate and method of manufacture thereof

In accordance with the present invention, an MCM substrate product is manufactured in an additive process using multiple layers of a fluoropolymer composite material and copper. The copper layers are plated, and the fluoropolymer composite layers are laminated. A seeding process promotes reliable bo...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BARTON, CARLOS L, TRASKOS, RICHARD T, KNEELAND, ANGELA M, HUNTINGTON, ROBERT B, NAVARRO, DANIEL J, BURDICK, LYNN E, SYLVESTER, MARK F, OTTO, JEFFREY B, SMITH, W. DAVID, CERCENA, JANE L, GAZIT, SAMUEL, OLENICK, JOHN A, KEMPTON, CURTIS H, HARPER, WILLIAM P, DEROSIER, SCOTT E, OLENICK, KATHLEEN R, KNEELAND, THOMAS S, RIVERS, JAMES S
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!