Film forming method in producing of semiconductor device

Upon the formation of a film on a semiconductor substrate by spin coating method, a polyimide precursor solution as a film forming solution is supplied dropwise onto the semiconductor substrate, and then the semiconductor substrate is started to be rotated at a low revolving speed of 1,000 rpm while...

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Bibliographische Detailangaben
1. Verfasser: SHINOHARA, MASAHIDE
Format: Patent
Sprache:eng ; fre ; ger
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