Universal surface mount package

A hermetically sealed surface mount electronic component package (10) can be manufactured by converting standard, readily available flat-packs. The package (10) has a base (11), with an opening through which a primary transmission lead (14) extends, a glass-to-metal seal (15) surrounding the primary...

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Bibliographische Detailangaben
Hauptverfasser:	ROHDE, META, JOSHI, SHANKAR
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A hermetically sealed surface mount electronic component package (10) can be manufactured by converting standard, readily available flat-packs. The package (10) has a base (11), with an opening through which a primary transmission lead (14) extends, a glass-to-metal seal (15) surrounding the primary transmission lead (14) in the opening, and a secondary transmission lead (17) extends from the primary transmission lead (14) so that it is spaced from the base (11) and its end is at least flush with the bottom of the base (11). An insulator (16) can be provided between the primary transmission lead (14) and the secondary transmission lead (17). A method of converting a standard flat-pack by providing a composite piece having a dielectric insulator (16), a secondary transmission lead (17) for connection to the primary transmission lead (14) of the flat-pack, and a connecting member (19) for connecting the insulator (16) and secondary transmission lead (17) to the base (11) of the flat-pack is also described.